Axisymmetric thermo-mechanical analysis of laser-driven non-contact transfer printing

Rui Li, Yuhang Li, Chaofeng Lü, Jizhou Song, Reza Saeidpourazar, Bo Fang, Yang Zhong, Placid M. Ferreira, John A. Rogers, Yonggang Huang*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

35 Scopus citations

Abstract

An axisymmetric thermo-mechanical model is developed for laser-driven non-contact transfer printing, which involves laser-induced impulsive heating to initiate separation at the interface between a soft, elastomeric stamp and hard micro/nanomaterials (i.e., inks) on its surface, due to a large mismatch in coefficients of thermal expansion. The result is the active ejection of the inks from the stamp, to a spatially separated receiving substrate, thereby representing the printing step. The model gives analytically the temperature field, and also a scaling law for the energy release rate for delamination at the interface between the stamp and an ink in the form of a rigid plate. The normalized critical laser pulse time for interfacial delamination depends only on the normalized absorbed laser power and width of the ink structure, and has been verified by experiments.

Original languageEnglish (US)
Pages (from-to)189-194
Number of pages6
JournalInternational Journal of Fracture
Volume176
Issue number2
DOIs
StatePublished - Aug 2012

Funding

Acknowledgments The materials presented here are based upon work supported by the Center for Nanoscale Chemical-Electrical-Mechanical System (NanoCEMMS), a Nano-scale Science and Engineering Center sponsored by NSF under Award #0749028 (CMMI). The support from NSF grants ECCS 0824129 and OISE 1043143 is also acknowledged. Y.H. acknowledges the support from NSFC. C.L. acknowledges the support from NSFC by Grant No. 11172263.

Keywords

  • Axisymmetric model
  • Laser-driven non-contact transfer printing
  • Stamp and ink
  • Thermo-mechanical analysis

ASJC Scopus subject areas

  • Computational Mechanics
  • Modeling and Simulation
  • Mechanics of Materials

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