Bendable integrated circuits on plastic substrates by use of printed ribbons of single-crystalline silicon

Jong Hyun Ahn, Hoon Sik Kim, Etienne Menard, Keon Jae Lee, Zhengtao Zhu, Dae Hyeong Kim, Ralph G. Nuzzo, John A. Rogers*, Islamshah Amlani, Vadim Kushner, Shawn G. Thomas, Terrisa Duenas

*Corresponding author for this work

Research output: Contribution to journalArticle

70 Scopus citations

Abstract

This letter presents studies of several simple integrated circuits- n -channel metal-oxide semiconductor inverters, five-stage ring oscillators, and differential amplifiers-formed on thin, bendable plastic substrates with printed ribbons of ultrathin single-crystalline silicon as the semiconductor. The inverters exhibit gains as high as 2.5, the ring oscillators operate with oscillation frequencies between 8 and 9 MHz at low supply voltages (∼4 V), and the differential amplifiers show good performance and voltage gains of 1.3 for 500 mV input signals. The responses of these systems to bending-induced strains show that relatively moderate changes of individual transistors can be significant for the operation of circuits that incorporate many transistors.

Original languageEnglish (US)
Article number213501
JournalApplied Physics Letters
Volume90
Issue number21
DOIs
StatePublished - Jun 1 2007

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

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    Ahn, J. H., Kim, H. S., Menard, E., Lee, K. J., Zhu, Z., Kim, D. H., Nuzzo, R. G., Rogers, J. A., Amlani, I., Kushner, V., Thomas, S. G., & Duenas, T. (2007). Bendable integrated circuits on plastic substrates by use of printed ribbons of single-crystalline silicon. Applied Physics Letters, 90(21), [213501]. https://doi.org/10.1063/1.2742294