Bias Sputter Deposition of Dense Yttria-Stabilized Zirconia Films on Porous Substrates

Tsepin Tsai, Scott A. Barnett

Research output: Contribution to journalArticlepeer-review

65 Scopus citations

Abstract

We demonstrate that completely dense yttria-stabilized zirconia (YSZ) electrolyte films <5 pm thick can be reactively sputter deposited onto porous (∼0.5 μm pore size) La0.8Sr0.2MnO3 substrate/electrodes. The two key factors in achieving the fully dense films were porous substrate preparation and the use of substrate bias during YSZ film deposition. Increasing the negative dc substrate bias Vs from 0 to 300 V produced increasingly dense and flat-surfaced films: Vs = 75 V was chosen to yield high density without excessive film compressive stresses. Solid oxide fuel cells consisting of sputtered YSZ films (Vs = 75 V) and a Ni-YSZ fuel electrode on LSM exhibited open-circuit voltage values within 5% of the theoretical values for thicknesses down to 2 pm. Cells deposited with Vs= 0 V short-circuited at thicknesses of 12 pm or less.

Original languageEnglish (US)
Pages (from-to)3084-3087
Number of pages4
JournalJournal of the Electrochemical Society
Volume142
Issue number9
DOIs
StatePublished - 1995

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry

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