TY - GEN
T1 - Bio-integrated electronics
AU - Rogers, J. A.
PY - 2012/12/1
Y1 - 2012/12/1
N2 - Biology is curved, soft and elastic; silicon wafers are not. Semiconductor technologies that can bridge this gap in form and mechanics will create new opportunities in devices that require intimate integration with the human body. This paper provides an overview of ideas for electronics, sensors and actuators that offer the performance of state-of-the-art, wafer-based systems but with the mechanical properties of a rubber band. We explain the underlying materials science and mechanics of these approaches, and illustrate their use in bio-integrated, 'tissue-like' devices with unique diagnostic and therapeutic capabilities, when conformally laminated onto the heart, brain or skin. Demonstrations in animal models and in humans illustrate the diverse functionality offered by these technologies, and suggest several clinically relevant applications.
AB - Biology is curved, soft and elastic; silicon wafers are not. Semiconductor technologies that can bridge this gap in form and mechanics will create new opportunities in devices that require intimate integration with the human body. This paper provides an overview of ideas for electronics, sensors and actuators that offer the performance of state-of-the-art, wafer-based systems but with the mechanical properties of a rubber band. We explain the underlying materials science and mechanics of these approaches, and illustrate their use in bio-integrated, 'tissue-like' devices with unique diagnostic and therapeutic capabilities, when conformally laminated onto the heart, brain or skin. Demonstrations in animal models and in humans illustrate the diverse functionality offered by these technologies, and suggest several clinically relevant applications.
UR - http://www.scopus.com/inward/record.url?scp=84876133634&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84876133634&partnerID=8YFLogxK
U2 - 10.1109/IEDM.2012.6478958
DO - 10.1109/IEDM.2012.6478958
M3 - Conference contribution
AN - SCOPUS:84876133634
SN - 9781467348706
T3 - Technical Digest - International Electron Devices Meeting, IEDM
BT - 2012 IEEE International Electron Devices Meeting, IEDM 2012
T2 - 2012 IEEE International Electron Devices Meeting, IEDM 2012
Y2 - 10 December 2012 through 13 December 2012
ER -