Biodegradable Electronic Systems in 3D, Heterogeneously Integrated Formats

Jan Kai Chang, Hui Ping Chang, Qinglei Guo, Jahyun Koo, Chih I. Wu, John A Rogers*

*Corresponding author for this work

Research output: Contribution to journalArticle

30 Scopus citations

Abstract

Biodegradable electronic systems represent an emerging class of technology with unique application possibilities, from temporary biomedical implants to “green” consumer gadgets. This paper introduces materials and processing methods for 3D, heterogeneously integrated devices of this type, with various functional examples in sophisticated forms of silicon-based electronics. Specifically, techniques for performing multilayer assembly by transfer printing and for fabricating layer-to-layer vias and interconnects by lithographic procedures serve as routes to biodegradable, 3D integrated circuits composed of functional building blocks formed using specialized approaches or sourced from commercial semiconductor foundries. Demonstration examples range from logic gates and analog circuits that undergo functional transformation by transience to systems that integrate multilayer resistive sensors for in situ, continuous electrical monitoring of the processes of transience. The results significantly expand the scope of engineering options for biodegradable electronics and other types of transient microsystem technologies.

Original languageEnglish (US)
Article number1704955
JournalAdvanced Materials
Volume30
Issue number11
DOIs
StatePublished - Mar 15 2018

Keywords

  • 3D integration
  • biodegradable electronics
  • flexible devices
  • heterogeneous integration
  • transfer printing

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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