TY - GEN
T1 - Bistable nature of the hydrophobic contact angle on rough surfaces
AU - He, Bo
AU - Patankar, Neelesh A.
AU - Lee, Junghoon
PY - 2003
Y1 - 2003
N2 - This paper studies the bistable nature of the hydrophobic contact angle on the rough surfaces. It was experimentally shown that a droplet of liquid can form two different contact angles on a surface that has roughness patterns. External disturbances can cause a transition between the two different energy states. This paper verifies the theoretical prediction by matching experiments and establishes a design criterion for a robust hydrophobic rough surface on which the contact angle will not change due to external disturbances. This fact is critical in microfluidic applications, where a rough surface is used for applications based on wettability amplification.
AB - This paper studies the bistable nature of the hydrophobic contact angle on the rough surfaces. It was experimentally shown that a droplet of liquid can form two different contact angles on a surface that has roughness patterns. External disturbances can cause a transition between the two different energy states. This paper verifies the theoretical prediction by matching experiments and establishes a design criterion for a robust hydrophobic rough surface on which the contact angle will not change due to external disturbances. This fact is critical in microfluidic applications, where a rough surface is used for applications based on wettability amplification.
KW - Hydrophobic contact angle
KW - Rough surface
UR - http://www.scopus.com/inward/record.url?scp=1942473886&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=1942473886&partnerID=8YFLogxK
U2 - 10.1115/imece2003-41536
DO - 10.1115/imece2003-41536
M3 - Conference contribution
AN - SCOPUS:1942473886
SN - 0791837211
SN - 9780791837214
T3 - American Society of Mechanical Engineers, Micro-Electromechanical Systems Division Publication (MEMS)
SP - 673
EP - 677
BT - Micro-Electro-Mechanical Systems (MEMS) - 2003
PB - American Society of Mechanical Engineers
T2 - 2003 ASME International Mechanical Engineering Congress
Y2 - 15 November 2003 through 21 November 2003
ER -