Bonding and interfacial reaction between Ni foil and n-type PbTe thermoelectric materials for thermoelectric module applications

Haiyang Xia*, Fivos Drymiotis, Cheng Lung Chen, Aiping Wu, G. Jeffrey Snyder

*Corresponding author for this work

Research output: Contribution to journalArticle

38 Scopus citations

Abstract

Integration of next generation thermoelectric materials in thermoelectric modules requires a novel or alternative approach for mating the brittle semiconducting thermoelectric materials and the ductile metal interconnects. In this study, pure Ni foil was directly bonded to PbTe-based thermoelectric materials using a rapid hot-press. The materials were sintered at 600 and 650 C, under a pressure of 40 MPa and for various holding times. The resulting interfacial microstructures of the Ni/PbTe joints were investigated. Additionally, the distributions of elements and the phases formed at the Ni/PbTe interface were analyzed. The β2 phase (Ni3±x Te2, 38.8-41 at.% Te) was identified at the Ni/PbTe joints bonded at both 600 and 650 C. A ternary phase with approximate composition Ni 5Pb2Te3 was found at the Ni/PbTe joints bonded at 650 C. Additionally, the PbTe(Ni) phase was observed along the Ni grain boundaries for both bonding temperatures. Thermodynamics calculation results indicate that only the β2 phase can be formed at the Ni/PbTe interface at 900 K among the binary nickel tellurides.

Original languageEnglish (US)
Pages (from-to)1716-1723
Number of pages8
JournalJournal of Materials Science
Volume49
Issue number4
DOIs
StatePublished - Feb 1 2014

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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