Cell-to-array thermal-aware analysis of stacked RRAM

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The crossbar resistive random access memory (RRAM) has been studied extensively due to its low-power, low-cost, high density and nonvolatile characteristics. However, the dependence of RRAM performance parameters on temperature, from cell to array level, is less explored. Particularly, thin-film based RRAM that is integrated into 3D ICs is subject to severe thermal conditions. Hence, temperature dependence of RRAM behavior needs to be well understood in order to construct the most effective thermal management strategy for these systems. In this paper, a detailed RRAM device thermal model is proposed. Our experiments show that the temperature of the surrounding environment critically impacts the RRAM readout margin, which in turn, jeopardizes its promised advantages for high-density stacked integration. Our thermal model can be utilized at the architectural level to predict the latency variation in the RRAM memory as a function of the thermal environment and drive thermal management policies for the 3D IC.

Original languageEnglish (US)
Title of host publicationIEEE International Symposium on Circuits and Systems
Subtitle of host publicationFrom Dreams to Innovation, ISCAS 2017 - Conference Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781467368520
DOIs
StatePublished - Sep 25 2017
Event50th IEEE International Symposium on Circuits and Systems, ISCAS 2017 - Baltimore, United States
Duration: May 28 2017May 31 2017

Publication series

NameProceedings - IEEE International Symposium on Circuits and Systems
ISSN (Print)0271-4310

Other

Other50th IEEE International Symposium on Circuits and Systems, ISCAS 2017
CountryUnited States
CityBaltimore
Period5/28/175/31/17

Keywords

  • RRAM
  • memory array
  • reliability
  • thermal analysis

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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