Abstract
X-ray microtomography is used to nondestructively section printed wiring boards in which conductive anodic filaments (CADs) had grown. Quantification of the spatial distribution of copper is compared for microtomography and for serial sections obtained in SEM with backscattered electrons. The agreement between the techniques is excellent and indicates that microtomography may be used confidently to follow the subsurface growth of CAFs.
Original language | English (US) |
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Title of host publication | Electronic Packaging Materials Science VII |
Editors | Peter Borgesen, Klavs F. Jensen, Roger A. Pollak |
Publisher | Publ by Materials Research Society |
Pages | 65-69 |
Number of pages | 5 |
Volume | 323 |
ISBN (Print) | 1558992227 |
State | Published - Jan 1 1994 |
Event | Proceedings of the Fall 1993 MRS Meeting - Boston, MA, USA Duration: Nov 29 1993 → Dec 3 1993 |
Other
Other | Proceedings of the Fall 1993 MRS Meeting |
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City | Boston, MA, USA |
Period | 11/29/93 → 12/3/93 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials