Cleavable Ligands Enable Uniform Close Packing in Colloidal Quantum Dot Solids

Graham H. Carey, Mingjian Yuan, Riccardo Comin, Oleksandr Voznyy, Edward H. Sargent*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

9 Scopus citations


Uniform close packing in colloidal quantum dot solids is critical for high-optical density, high-mobility optoelectronic devices. A hybrid-ligand strategy is developed, combining the advantages of solid state and solution-phase ligand exchanges. This strategy uses a medium length thioamide ligand that is readily cleaved in a single chemical treatment, leading to quantum dot solids with uniformly packed domains 3 times larger than those observed in ligand-exchanged films.

Original languageEnglish (US)
Pages (from-to)21995-22000
Number of pages6
JournalACS Applied Materials and Interfaces
Issue number39
StatePublished - Oct 7 2015


  • colloidal quantum dot
  • densification
  • ligand cleavage
  • thin films
  • thioamide

ASJC Scopus subject areas

  • General Materials Science


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