Abstract
Uniform close packing in colloidal quantum dot solids is critical for high-optical density, high-mobility optoelectronic devices. A hybrid-ligand strategy is developed, combining the advantages of solid state and solution-phase ligand exchanges. This strategy uses a medium length thioamide ligand that is readily cleaved in a single chemical treatment, leading to quantum dot solids with uniformly packed domains 3 times larger than those observed in ligand-exchanged films.
Original language | English (US) |
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Pages (from-to) | 21995-22000 |
Number of pages | 6 |
Journal | ACS Applied Materials and Interfaces |
Volume | 7 |
Issue number | 39 |
DOIs | |
State | Published - Oct 7 2015 |
Keywords
- colloidal quantum dot
- densification
- ligand cleavage
- thin films
- thioamide
ASJC Scopus subject areas
- Materials Science(all)