The interfacial reactions between Sn-3.5Ag, Sn-57Bi, and Sn-38Pb eutectic solders and electroplated Ni/Pd on Cu substrate were investigated. The interfacial microstructure was characterized by imaging and energy dispersive X-ray analysis in scanning electron microscope. The presence or absence of Pd-bearing intermetallic was correlated with the diffusion path in Pd alloys. Both the radial growth and the thickening kinetics of Ni3Sn4 intermetallic were studied.
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry