Comparative study of the kinetics of interfacial reaction between eutectic solders and Cu/Ni/Pd metallization

G. Ghosh

doi:10.1007/s11664-000-0011-x

Comparative study of the kinetics of interfacial reaction between eutectic solders and Cu/Ni/Pd metallization

G. Ghosh^*

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

19 Scopus citations

Abstract

The interfacial reactions between Sn-3.5Ag, Sn-57Bi, and Sn-38Pb eutectic solders and electroplated Ni/Pd on Cu substrate were investigated. The interfacial microstructure was characterized by imaging and energy dispersive X-ray analysis in scanning electron microscope. The presence or absence of Pd-bearing intermetallic was correlated with the diffusion path in Pd alloys. Both the radial growth and the thickening kinetics of Ni₃Sn₄ intermetallic were studied.

Original language	English (US)
Pages (from-to)	1182-1193
Number of pages	12
Journal	Journal of Electronic Materials
Volume	29
Issue number	10
DOIs	https://doi.org/10.1007/s11664-000-0011-x
State	Published - Oct 2000
Externally published	Yes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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abstract = "The interfacial reactions between Sn-3.5Ag, Sn-57Bi, and Sn-38Pb eutectic solders and electroplated Ni/Pd on Cu substrate were investigated. The interfacial microstructure was characterized by imaging and energy dispersive X-ray analysis in scanning electron microscope. The presence or absence of Pd-bearing intermetallic was correlated with the diffusion path in Pd alloys. Both the radial growth and the thickening kinetics of Ni3Sn4 intermetallic were studied.",

author = "G. Ghosh",

year = "2000",

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doi = "10.1007/s11664-000-0011-x",

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AB - The interfacial reactions between Sn-3.5Ag, Sn-57Bi, and Sn-38Pb eutectic solders and electroplated Ni/Pd on Cu substrate were investigated. The interfacial microstructure was characterized by imaging and energy dispersive X-ray analysis in scanning electron microscope. The presence or absence of Pd-bearing intermetallic was correlated with the diffusion path in Pd alloys. Both the radial growth and the thickening kinetics of Ni3Sn4 intermetallic were studied.

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Comparative study of the kinetics of interfacial reaction between eutectic solders and Cu/Ni/Pd metallization

Abstract

ASJC Scopus subject areas

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