Comparative study of the kinetics of interfacial reaction between eutectic solders and Cu/Ni/Pd metallization

Gautam Ghosh*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

19 Scopus citations

Abstract

The interfacial reactions between Sn-3.5Ag, Sn-57Bi, and Sn-38Pb eutectic solders and electroplated Ni/Pd on Cu substrate were investigated. The interfacial microstructure was characterized by imaging and energy dispersive X-ray analysis in scanning electron microscope. The presence or absence of Pd-bearing intermetallic was correlated with the diffusion path in Pd alloys. Both the radial growth and the thickening kinetics of Ni3Sn4 intermetallic were studied.

Original languageEnglish (US)
Pages (from-to)1182-1193
Number of pages12
JournalJournal of Electronic Materials
Volume29
Issue number10
DOIs
StatePublished - Jan 1 2000

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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