Comparative study of the kinetics of interfacial reaction between eutectic solders and Cu/Ni/Pd metallization

Keyphrases

• Intermetallics 100%
• Interfacial Reaction 100%
• Ni-Pd 100%
• Cu-Ni 100%
• Metallization 100%
• Eutectic Solder 100%
• Scanning Electron Microscope 50%
• Energy Dispersive X-ray Analysis 50%
• Cu Substrate 50%
• Diffusion Path 50%
• Interfacial Microstructure 50%
• Radial Growth 50%
• Ag3Sn 50%
• Ni3S4 50%
• Pd Alloys 50%
• Electroplated Ni 50%

Engineering

• Metallizations 100%
• Eutectics 100%
• Intermetallics 100%
• Diffusion Path 50%
• Energy-Dispersive X-Ray Analysis 50%
• Scanning Electron Microscope 50%

Material Science

• Intermetallics 100%
• Scanning Electron Microscopy 50%
• Energy Dispersive X Ray Analysis 50%