Compressive creep behavior of hot-pressed Mg1.96Al0.04Si0.97Bi0.03

Richard A. Michi; Gwansik Kim; Byung Wook Kim; Wooyoung Lee; David C. Dunand

doi:10.1016/j.scriptamat.2018.01.011

Compressive creep behavior of hot-pressed Mg_1.96Al_0.04Si_0.97Bi_0.03

Richard A. Michi, Gwansik Kim, Byung Wook Kim, Wooyoung Lee^*, David C. Dunand

^*Corresponding author for this work

Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

9 Scopus citations

Abstract

The compressive creep behavior of hot-pressed Mg_1.96Al_0.04Si_0.97Bi_0.03, a promising thermoelectric material, is investigated at 500 °C. At stress levels between 81 and 212 MPa, dislocation creep with stress exponent n = 7.6 ± 0.3 is observed. No diffusional creep is observed, likely attributable to a dispersion of ~1 μm Bi-, Al-, and O- rich particles which pin grain boundaries. Mg_1.96Al_0.04Si_0.97Bi_0.03 exhibits similar creep behavior to previously studied silicides, but is significantly more creep resistant than other thermoelectric materials, PbTe and Bi₂Te₃. This makes Mg_1.96Al_0.04Si_0.97Bi_0.03 an excellent material for thermoelectric power generation systems subjected to high stresses and temperatures.

Original language	English (US)
Pages (from-to)	10-14
Number of pages	5
Journal	Scripta Materialia
Volume	148
DOIs	https://doi.org/10.1016/j.scriptamat.2018.01.011
State	Published - Apr 15 2018

Funding

This work made use of the MatCI Facility which receives support from the MRSEC Program (NSF DMR-1121262) of the Materials Research Center at Northwestern University. This work made use of the EPIC facility of Northwestern University's NUANCE Center, which has received support from the MRSEC program (NSF DMR-1121262) at the Materials Research Center; the International Institute for Nanotechnology (IIN); and the State of Illinois, through the IIN. WL thanks the Grant ( 2017R1A2A1A17069528 ) and Priority Research Centers Program (2009-0093823) funded by National Research Foundation of Korea (NRF) and Hyundai Motor Company ( 2016-11-0532 ).

Keywords

Creep
Hot pressing
Magnesium silicide
Silicides
Thermoelectric materials

ASJC Scopus subject areas

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering
Metals and Alloys

Access to Document

10.1016/j.scriptamat.2018.01.011

Cite this

@article{e856e07d97004d7c8781ba3259ddd03c,

title = "Compressive creep behavior of hot-pressed Mg1.96Al0.04Si0.97Bi0.03",

abstract = "The compressive creep behavior of hot-pressed Mg1.96Al0.04Si0.97Bi0.03, a promising thermoelectric material, is investigated at 500 °C. At stress levels between 81 and 212 MPa, dislocation creep with stress exponent n = 7.6 ± 0.3 is observed. No diffusional creep is observed, likely attributable to a dispersion of ~1 μm Bi-, Al-, and O- rich particles which pin grain boundaries. Mg1.96Al0.04Si0.97Bi0.03 exhibits similar creep behavior to previously studied silicides, but is significantly more creep resistant than other thermoelectric materials, PbTe and Bi2Te3. This makes Mg1.96Al0.04Si0.97Bi0.03 an excellent material for thermoelectric power generation systems subjected to high stresses and temperatures.",

keywords = "Creep, Hot pressing, Magnesium silicide, Silicides, Thermoelectric materials",

author = "Michi, {Richard A.} and Gwansik Kim and Kim, {Byung Wook} and Wooyoung Lee and Dunand, {David C.}",

note = "Publisher Copyright: {\textcopyright} 2018",

year = "2018",

month = apr,

day = "15",

doi = "10.1016/j.scriptamat.2018.01.011",

language = "English (US)",

volume = "148",

pages = "10--14",

journal = "Scripta Materialia",

issn = "1359-6462",

publisher = "Elsevier Limited",

}

TY - JOUR

T1 - Compressive creep behavior of hot-pressed Mg1.96Al0.04Si0.97Bi0.03

AU - Michi, Richard A.

AU - Kim, Gwansik

AU - Kim, Byung Wook

AU - Lee, Wooyoung

AU - Dunand, David C.

PY - 2018/4/15

Y1 - 2018/4/15

N2 - The compressive creep behavior of hot-pressed Mg1.96Al0.04Si0.97Bi0.03, a promising thermoelectric material, is investigated at 500 °C. At stress levels between 81 and 212 MPa, dislocation creep with stress exponent n = 7.6 ± 0.3 is observed. No diffusional creep is observed, likely attributable to a dispersion of ~1 μm Bi-, Al-, and O- rich particles which pin grain boundaries. Mg1.96Al0.04Si0.97Bi0.03 exhibits similar creep behavior to previously studied silicides, but is significantly more creep resistant than other thermoelectric materials, PbTe and Bi2Te3. This makes Mg1.96Al0.04Si0.97Bi0.03 an excellent material for thermoelectric power generation systems subjected to high stresses and temperatures.

AB - The compressive creep behavior of hot-pressed Mg1.96Al0.04Si0.97Bi0.03, a promising thermoelectric material, is investigated at 500 °C. At stress levels between 81 and 212 MPa, dislocation creep with stress exponent n = 7.6 ± 0.3 is observed. No diffusional creep is observed, likely attributable to a dispersion of ~1 μm Bi-, Al-, and O- rich particles which pin grain boundaries. Mg1.96Al0.04Si0.97Bi0.03 exhibits similar creep behavior to previously studied silicides, but is significantly more creep resistant than other thermoelectric materials, PbTe and Bi2Te3. This makes Mg1.96Al0.04Si0.97Bi0.03 an excellent material for thermoelectric power generation systems subjected to high stresses and temperatures.

KW - Creep

KW - Hot pressing

KW - Magnesium silicide

KW - Silicides

KW - Thermoelectric materials

UR - http://www.scopus.com/inward/record.url?scp=85041462921&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85041462921&partnerID=8YFLogxK

U2 - 10.1016/j.scriptamat.2018.01.011

DO - 10.1016/j.scriptamat.2018.01.011

M3 - Article

AN - SCOPUS:85041462921

SN - 1359-6462

VL - 148

SP - 10

EP - 14

JO - Scripta Materialia

JF - Scripta Materialia

ER -