Constitutive model and numerical analysis for high lead solder interconnects

Fan Wang*, Leon M. Keer, Semyon Vaynman, Shengmin Wen

*Corresponding author for this work

Research output: Contribution to conferencePaper

Abstract

High lead solder interconnects are extensively used in the electronic industry. This paper uses a unified creep plasticity (UCP) constitutive model to numerically simulate the mechanical performance of such interconnects under thermomechanial cyclic loading. The UCP model is capable of incorporating thermal and cyclic hardening effects. To make the model more objective, cyclic loading induced damage was also incorporated. The model is programmed into the commercially available FEM software ABAQUS. A uniaxial tension case was analyzed to verify the model and reasonable agreement with experimental results was achieved. A typical three-dimensioned (3D) solder bump under shear loading was analyzed and the strain/stress distribution within the solder bump was obtained.

Original languageEnglish (US)
Pages153-159
Number of pages7
StatePublished - Sep 20 2004
EventITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Las Vegas, NV, United States
Duration: Jun 1 2004Jun 4 2004

Other

OtherITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
CountryUnited States
CityLas Vegas, NV
Period6/1/046/4/04

Keywords

  • ABAQUS
  • Constitutive modeling
  • Creep
  • Damage
  • High lead solder
  • Inelasticity
  • Plasticity

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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  • Cite this

    Wang, F., Keer, L. M., Vaynman, S., & Wen, S. (2004). Constitutive model and numerical analysis for high lead solder interconnects. 153-159. Paper presented at ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, United States.