Constitutive model and numerical analysis for high lead solders

Fan Wang*, Leon M. Keer, Semyon Vaynman, Shengmin Wen

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

7 Scopus citations


High lead solder interconnects are extensively used in the electronic industry. This paper uses a unified creep plasticity (UCP) constitutive model to numerically simulate the mechanical performance of such interconnects under thermomechanial cyclic loading. The UCP model is capable of incorporating thermal and cyclic hardening effects. To make the model more objective, cyclic loading induced damage was also incorporated. The model is programmed into the commercially available finite element modeling software ABAQUS. A uniaxial tension case was analyzed to verify the model and reasonable agreement with experimental results was achieved. A typical three-dimensioned solder bump under shear deformation loading was analyzed and the strain/stress distribution within the solder bump was obtained.

Original languageEnglish (US)
Pages (from-to)718-723
Number of pages6
JournalIEEE Transactions on Components and Packaging Technologies
Issue number4
StatePublished - Dec 2004


  • Constitutive modeling
  • Creep
  • Damage
  • High lead solder
  • Inelasticity
  • Plasticity

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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