Abstract
High lead solder interconnects are extensively used in the electronic industry. This paper uses a unified creep plasticity (UCP) constitutive model to numerically simulate the mechanical performance of such interconnects under thermomechanial cyclic loading. The UCP model is capable of incorporating thermal and cyclic hardening effects. To make the model more objective, cyclic loading induced damage was also incorporated. The model is programmed into the commercially available finite element modeling software ABAQUS. A uniaxial tension case was analyzed to verify the model and reasonable agreement with experimental results was achieved. A typical three-dimensioned solder bump under shear deformation loading was analyzed and the strain/stress distribution within the solder bump was obtained.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 718-723 |
| Number of pages | 6 |
| Journal | IEEE Transactions on Components and Packaging Technologies |
| Volume | 27 |
| Issue number | 4 |
| DOIs | |
| State | Published - Dec 2004 |
| Externally published | Yes |
Funding
Manuscript received February 1, 2004; revised May 27, 2004. This work was supported by the Semiconductor Research Corporation through a customized program from Advanced Micro Devices, Inc. This work was recommended for publication by Associate Editor K. Ramakrishna upon evaluation of the reviewers’ comments.
Keywords
- ABAQUS
- Constitutive modeling
- Creep
- Damage
- High lead solder
- Inelasticity
- Plasticity
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering