Contact radius of stamps in reversible adhesion

Jian Wu, Seok Kim, Andrew Carlson, Chaofeng Lu, Keh Chih Hwang, Yonggang Huang*, John A. Rogers

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

6 Scopus citations

Abstract

A mechanics model is developed for the contact radius of stamps with pyramid tips in transfer printing. This is important to the realization of reversible control of adhesion, which has many important applications, such as climbing robots, medical tapes, and transfer printing of electronics. The contact radius is shown to scale linearly with the work of adhesion between the stamp and the contacting surface, and inversely with the plane-strain modulus of the stamp. It also depends on the cone angle and tip radius of the stamp, but is essentially independent of details of the tip geometry.

Original languageEnglish (US)
Pages (from-to)11001
Number of pages1
JournalTheoretical and Applied Mechanics Letters
Volume1
Issue number1
DOIs
StatePublished - 2011

Keywords

  • contact mechanics
  • contact radius
  • reversible adhesion

ASJC Scopus subject areas

  • Computational Mechanics
  • Environmental Engineering
  • Civil and Structural Engineering
  • Biomedical Engineering
  • Aerospace Engineering
  • Ocean Engineering
  • Mechanics of Materials
  • Mechanical Engineering

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