Correlation of magnetoresistance with deposition parameters and annealing in CoFe/Cu multilayers

Y. Q. Ma, A. Cerezo, A. Georgalakis, A. K. Petford-Long, S. P. Bozeman, H. Bown, P. H. Clifton, D. J. Larson

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Correlation of magnetoresistance to nanoscale microstructural properties is desirable for optimization of multilayer films designed for magnetic recording applications. Recently, the characterization technique of three-dimensional atom probe (3DAP) analysis has been successfully applied to such structures. Unlike techniques such as x-ray diffraction or transmission microscopy, 3DAP has the capability to deconvolute chemical mixing at multilayer interfaces from morphological roughness. In the current work, a multilayer stack consisting of Si/seed/CoFe/(Cu/CoFe)x5/cap has been studied.

Original languageEnglish (US)
Title of host publicationINTERMAG Europe 2002 - IEEE International Magnetics Conference
EditorsJ. Fidler, B. Hillebrands, C. Ross, D. Weller, L. Folks, E. Hill, M. Vazquez Villalabeitia, J. A. Bain, Jo De Boeck, R. Wood
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)0780373650, 9780780373655
DOIs
StatePublished - 2002
Event2002 IEEE International Magnetics Conference, INTERMAG Europe 2002 - Amsterdam, Netherlands
Duration: Apr 28 2002May 2 2002

Publication series

NameINTERMAG Europe 2002 - IEEE International Magnetics Conference

Other

Other2002 IEEE International Magnetics Conference, INTERMAG Europe 2002
Country/TerritoryNetherlands
CityAmsterdam
Period4/28/025/2/02

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering
  • Surfaces, Coatings and Films

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