CuAAC-based assembly and characterization of a ruthenium-copper dyad containing a diimine-dioxime ligand framework

Nicolas Queyriaux, Eugen S. Andreiadis, Stéphane Torelli, Jacques Pecaut, Brad S. Veldkamp, Eric A. Margulies, Michael R. Wasielewski, Murielle Chavarot-Kerlidou*, Vincent Artero

*Corresponding author for this work

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