Cure monitoring in resin transfer molding by means of dielectric sensor and cure model

Didier Lefebve*, John M. Bayldon, Isaac M Daniel

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

3 Scopus citations

Abstract

Resin Transfer Molding technology has matured significantly in recent years, and it is apparent that to optimize the process and improve quality assurance some method is required to detect the critical points in the cure process (e.g, gelation point and end of cure). Two technologies are considered, both of which use tool-mounted sensors, and require access to only one side of the mould: The first technology uses a fringe field dielectric sensor to measure viscosity via ionic conductivity: The second relies on a cure model using thermal history measured by thermocouples to calculate the expected degree of cure. A tool incorporating both a dielectric sensor and a thermocouple was used to study the degree of cure. The results from both methods were compared to the degree of cure, as calculated from DSC measurements of resin samples exposed to the same thermal conditions as the mold. Both methods showed good promise, though each has its own specific advantages and weaknesses.

Original languageEnglish (US)
Pages (from-to)1672-1682
Number of pages11
JournalInternational SAMPE Symposium and Exhibition (Proceedings)
Volume48 II
StatePublished - Dec 1 2003
EventAdvancing Materials in the Global Economy - Applications, Emerging Markets and Evolving Technologies - Long Beach, CA, United States
Duration: May 11 2003May 15 2003

Keywords

  • Cure Monitoring
  • Dielectric Cure sensor
  • Epoxy Resin
  • Resin Transfer Molding (RTM)

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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