Keyphrases
Reducing Agent
100%
Ascorbic Acid
100%
Cu2O Thin Film
100%
Spray Pyrolysis
100%
Diethanolamine
100%
Copper(II) Oxide
50%
Precursor Solution
50%
D-glucose
33%
Deposition Temperature
33%
Optical Properties
16%
Structural Properties
16%
Crystallinity
16%
Electrical Properties
16%
Diverse Applications
16%
Morphological Properties
16%
Nanocrystalline
16%
Film Properties
16%
Homogeneous Solution
16%
Band Gap Energy
16%
Volatilization
16%
Low Resistivity
16%
Molar Concentration
16%
XRD Analysis
16%
Impurity Content
16%
In Situ Reduction
16%
Copper(II) Nitrate
16%
Copper(II) Acetate
16%
Copper Salts
16%
Organic Impurities
16%
Material Science
Spray Pyrolysis
100%
Thin Films
100%
Vitamin C
100%
Reducing Agent
100%
Film
66%
Electrical Resistivity
16%
X-Ray Diffraction
16%
Nanocrystalline
16%
Optical Property
16%
Morphology
16%
Engineering
Pyrolysis
100%
Thin Films
100%
Precursor Solution
60%
Deposition Temperature
40%
X-Ray Diffraction Analysis
20%
Molar Concentration
20%
Situ Reduction
20%
Film Property
20%
Energy Engineering
20%
Nanocrystalline
20%
Vaporization
20%
Crystallinity
20%
Impurity Content
20%
Organic Impurity
20%
Band Gap
20%
Chemical Engineering
Ascorbic Acid
100%
Pyrolysis
100%
Film
100%