Damage based fatigue criterion for solders in electronic packaging

Shengmin Wen*, Leon M Keer

*Corresponding author for this work

Research output: Contribution to conferencePaper

3 Scopus citations

Abstract

A fatigue theory with its definition of fatigue failure criterion based on physical damage mechanism is presented for solders. Mura's micromechanical fatigue model is adopted and extended to each individual grain of the solder structure, where grain's crystallographic orientation is taken into account. A solder structure is defined as fatigued when the portion of its failed grains reaches a critical percolation threshold, since at this point the failed grains may form a large cluster, leading to structural instability and fatigue failure. Experimental data for 96.5Pb-3.5Sn solder showed good agreement with the prediction by the theory and its failure criterion. The theory is anisotropic, and thus there is no size limitation to its application, making it applicable to anisotropic small-scale (micron scale or smaller) solder joints.

Original languageEnglish (US)
Pages184-191
Number of pages8
StatePublished - Sep 20 2004
EventITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Las Vegas, NV, United States
Duration: Jun 1 2004Jun 4 2004

Other

OtherITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
CountryUnited States
CityLas Vegas, NV
Period6/1/046/4/04

Keywords

  • Anisotropic
  • Fatigue
  • Micromechanics
  • Percolation
  • Size effect
  • Solders

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Fingerprint Dive into the research topics of 'Damage based fatigue criterion for solders in electronic packaging'. Together they form a unique fingerprint.

  • Cite this

    Wen, S., & Keer, L. M. (2004). Damage based fatigue criterion for solders in electronic packaging. 184-191. Paper presented at ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, United States.