Damage characterization and its incorporation into the constitutive model for several solders in electronic packaging

Shengmin Wen, Leon M Keer*

*Corresponding author for this work

Research output: Contribution to journalArticle

1 Scopus citations

Abstract

A materials science based damage metric is presented for solders in electronic packaging. The damage metric characterizes the damage state when solders are subjected to cyclic thermal strain due to mismatch of the coefficient of thermal expansion (CTE). The damage metric is derived through a micromechanics approach, and its relationship to the damage parameters is assumed to follow power law. A unified creep and plasticity constitutive model with damage incorporation showed reasonable agreement with the experimental results for two solders under a one-dimensional strain controlled fatigue test.

Original languageEnglish (US)
Pages (from-to)355-366
Number of pages12
JournalInternational Journal of Damage Mechanics
Volume11
Issue number4
DOIs
StatePublished - Jan 1 2002

Keywords

  • Constitutive model
  • Damage
  • Micromechanics
  • Percolation
  • Solders

ASJC Scopus subject areas

  • Computational Mechanics
  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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