Damage evolution governed by microcrack nucleation with application to the fatigue of 63Sn-37Pb solder

V. Stolkarts*, Leon M Keer, M. E. Fine

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

59 Scopus citations

Abstract

In many materials, including tin-lead eutectic solder, a substantial portion of their fatigue life is spent in accumulation of randomly distributed microcracks. An assembly of discrete interconnected elements (e.g. grains or phases) approximates the solid in this paper. Percolation theory is employed to derive critical microcrack density and to predict size effect. Self-similarity in microcrack nucleation leads to a simple power law for lifetime prediction. Its application to the fatigue of tin-lead eutectic solder shows a good agreement with experimental data.

Original languageEnglish (US)
Pages (from-to)2451-2468
Number of pages18
JournalJournal of the Mechanics and Physics of Solids
Volume47
Issue number12
DOIs
StatePublished - Jan 1 1999

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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