Density, distribution and nature of planar faults in silver antimony telluride for thermoelectric applications

L. Abdellaoui, Siyuan Zhang, Stefan Zaefferer, R. Bueno-Villoro, Andrei Baranovskiy, Oana Cojocaru-Mirédin, Yuan Yu, Y. Amouyal, D. Raabe, Gerald Jeffrey Snyder, Christina Scheu*

*Corresponding author for this work

Research output: Contribution to journalArticle

1 Scopus citations

Abstract

Defects such as planar faults in thermoelectric materials improve their performance by scattering phonons with short and medium mean free paths (3–100 nm), thereby reducing the lattice thermal conductivity,κl. Understanding statistically the microscopic distribution of these extended defects within the grains and in low angle grain boundaries is necessary to tailor and develop materials with optimal thermoelectric performance for waste heat harvesting. Herein, we analyze these defects from the millimeter down to the nanometer scale in a AgSbTe2 thermoelectric material with low angle grain boundaries. The investigations were performed using electron channeling contrast imaging combined with transmission electron microscopy. The microstructure study was complemented by estimating the effect of planar faults on the phonon scattering using the Debye-Callaway model. AgSbTe2 is a promising thermoelectric material, which exhibits extremely low thermal conductivity, κ, of 0.5 Wm−1K−1 at room temperature. In contrast to conventional alloys or intermetallic materials, in the present material small angle grain boundaries are not composed of individual dislocations but of a dense arrangement of stacked planar faults with fault densities up to NPF=1.6⋅108m−1. We explain their abundance based on their low interfacial energy of about 186 mJm−2 calculated ab-initio. The current findings show, that it is possible to reach very high densities of phonon-scattering planar faults by the correct microstructure engineering in AgSbTe2 thermoelectric materials.

Original languageEnglish (US)
Pages (from-to)135-145
Number of pages11
JournalActa Materialia
Volume178
DOIs
StatePublished - Oct 1 2019

Keywords

  • Electron microscopy
  • Planar faults
  • Silver-antimony-telluride compounds
  • Thermal conductivity
  • Thermoelectric materials

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Ceramics and Composites
  • Polymers and Plastics
  • Metals and Alloys

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    Abdellaoui, L., Zhang, S., Zaefferer, S., Bueno-Villoro, R., Baranovskiy, A., Cojocaru-Mirédin, O., Yu, Y., Amouyal, Y., Raabe, D., Snyder, G. J., & Scheu, C. (2019). Density, distribution and nature of planar faults in silver antimony telluride for thermoelectric applications. Acta Materialia, 178, 135-145. https://doi.org/10.1016/j.actamat.2019.07.031