Design for reliability of multi-layer stretchable interconnects

Yung Yu Hsu*, Cole Papakyrikos, Daniel Liu, Xianyan Wang, Milan Raj, Baosheng Zhang, Roozbeh Ghaffari

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

12 Scopus citations

Abstract

In this investigation, the electrical performance and reliability of multi-layer stretchable metal interconnects are evaluated using numerical simulations and experimental analysis. The numerical results show that the bi-layer design of stretchable interconnects have similar mechanics when compared to single layer interconnect structures. In contrast, interconnects configured in an in-plane stacked arrangement exhibit increased equivalent plastic strain during elongation, and consequently support less stretching. Our experimental results support these numerical findings. Maximum stretchability approaches ∼150% elongation for single layer and bi-layer interconnects. In addition, fatigue experiments at 60% elongation show that the bi-layer design of stretchable interconnects have life cycles three orders of magnitude higher than the in-plane stacked arrangement of stretchable interconnects.

Original languageEnglish (US)
Article number095014
JournalJournal of Micromechanics and Microengineering
Volume24
Issue number9
DOIs
StatePublished - Sep 1 2014

Keywords

  • failure analysis
  • interconnect
  • reliability
  • stretchable electronics

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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