Abstract
In this investigation, the electrical performance and reliability of multi-layer stretchable metal interconnects are evaluated using numerical simulations and experimental analysis. The numerical results show that the bi-layer design of stretchable interconnects have similar mechanics when compared to single layer interconnect structures. In contrast, interconnects configured in an in-plane stacked arrangement exhibit increased equivalent plastic strain during elongation, and consequently support less stretching. Our experimental results support these numerical findings. Maximum stretchability approaches ∼150% elongation for single layer and bi-layer interconnects. In addition, fatigue experiments at 60% elongation show that the bi-layer design of stretchable interconnects have life cycles three orders of magnitude higher than the in-plane stacked arrangement of stretchable interconnects.
Original language | English (US) |
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Article number | 095014 |
Journal | Journal of Micromechanics and Microengineering |
Volume | 24 |
Issue number | 9 |
DOIs | |
State | Published - Sep 1 2014 |
Keywords
- failure analysis
- interconnect
- reliability
- stretchable electronics
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Mechanics of Materials
- Mechanical Engineering
- Electrical and Electronic Engineering