Design for reliability of multi-layer thin film stretchable interconnects

Yung Yu Hsu, Kylie Lucas, Dan Davis, Rooz Ghaffari, Brian Elolampi, Mitul Dalal, John Work, Stephen Lee, Conor Rafferty, Kevin Dowling

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

To date, nearly all electronic systems have been rigid and inflexible. However, there are many areas such as in biomedical devices in which these rigid electronics are less than ideal and which require new conformable electronic systems. In order to create effective, compact, and complex systems, stretchable interconnects must be designed to overlap one another in multiple layers. The circular strain relief structure described in this paper effectively redistributes the strain to the crest of the horseshoes of the interconnects themselves. Numerical analysis and simulations of the strain relief structures described in this paper indicate that the structures will function indefinitely when stretched up to a 20% elongation. In-situ electromechanical measurements show that the structures are able to withstand elongations of 285% or more before failing. Precise failure mechanisms including straightening of the interconnects and micro-crack formation are documented with images taken during the electromechanical tests.

Original languageEnglish (US)
Title of host publication2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
Pages623-628
Number of pages6
DOIs
StatePublished - Sep 9 2013
Event2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 - Las Vegas, NV, United States
Duration: May 28 2013May 31 2013

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
CountryUnited States
CityLas Vegas, NV
Period5/28/135/31/13

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Design for reliability of multi-layer thin film stretchable interconnects'. Together they form a unique fingerprint.

  • Cite this

    Hsu, Y. Y., Lucas, K., Davis, D., Ghaffari, R., Elolampi, B., Dalal, M., Work, J., Lee, S., Rafferty, C., & Dowling, K. (2013). Design for reliability of multi-layer thin film stretchable interconnects. In 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 (pp. 623-628). [6575638] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2013.6575638