Design of a 3-DOF compliant parallel mechanism for displacement amplification

Qiang Zeng*, Kornel F. Ehmann

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

Prevalent general design methods and applications of compliant displacement amplifiers are focused on 1-DOF units composed into serial structures, which are limited by their output motions, stiffness, heat balance, repeatability and resonant frequencies. To improve the output properties of compliant displacement amplifiers, a monolithic structure is presented in the form of a compliant parallel mechanism. In the proposed moving structure, the compliant mechanism of the displacement amplifier is designed with 3-DOF to generate uniformly magnified output properties in all directions. High first resonant frequencies and amplification ratios are achieved in a compact size compared to existing compliant displacement amplifiers. The related kinematics, amplification ratios and resonant frequencies of the amplifier are analytically modeled, and the results are simulated by finite-element analysis. The proposed design is employable for micro/nano positioning stages operating within a prismatic output workspace.

Original languageEnglish (US)
Title of host publicationASME 2013 International Manufacturing Science and Engineering Conference Collocated with the 41st North American Manufacturing Research Conference, MSEC 2013
DOIs
StatePublished - Dec 18 2013
EventASME 2013 International Manufacturing Science and Engineering Conference Collocated with the 41st North American Manufacturing Research Conference, MSEC 2013 - Madison, WI, United States
Duration: Jun 10 2013Jun 14 2013

Publication series

NameASME 2013 International Manufacturing Science and Engineering Conference Collocated with the 41st North American Manufacturing Research Conference, MSEC 2013
Volume1

Other

OtherASME 2013 International Manufacturing Science and Engineering Conference Collocated with the 41st North American Manufacturing Research Conference, MSEC 2013
CountryUnited States
CityMadison, WI
Period6/10/136/14/13

Keywords

  • Compliant parallel mechanism
  • Displacement amplification
  • Flexure hinge

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering

Fingerprint Dive into the research topics of 'Design of a 3-DOF compliant parallel mechanism for displacement amplification'. Together they form a unique fingerprint.

Cite this