Design of gradient copolymers for damping applications over uniquely broad temperature ranges

Michelle M. Mok, Jungki Kim, John M Torkelson

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Gradient copolymers with different incompatibility and gradient steepness were employed to design materials with good damping properties over wide temperature ranges (e.g. 70-100 K). A study was carried out on a styrene/hydroxystyrene system (S/HS) with χ = 6 and an S/butyl acrylate system (S/BA) with χ = 0.087. Gradient steepness was controlled by the addition rate of the second monomer during polymerization. The S/HS system showed very broad damping behavior at moderate gradients, due to severe incompatibility of its components. Meanwhile, the S/BA system demonstrated just slightly broadened damping behavior at moderate gradients, but very broad damping was observed at stronger gradients.

Original languageEnglish (US)
Title of host publicationSociety of Plastics Engineers - 66th Annual Technical Conference of the Society of Plastics Engineers, Plastics Encounter at ANTEC 2008
Pages1296-1300
Number of pages5
Volume2
StatePublished - Sep 29 2008
Event66th Annual Technical Conference of the Society of Plastics Engineers, Plastics Encounter at ANTEC 2008 - Milwaukee, WI, United States
Duration: May 4 2008May 8 2008

Other

Other66th Annual Technical Conference of the Society of Plastics Engineers, Plastics Encounter at ANTEC 2008
CountryUnited States
CityMilwaukee, WI
Period5/4/085/8/08

Keywords

  • ANTEC
  • Damping
  • Ellipsometry
  • Glass transition breadth
  • Gradient copolymers

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Materials Chemistry
  • Polymers and Plastics

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  • Cite this

    Mok, M. M., Kim, J., & Torkelson, J. M. (2008). Design of gradient copolymers for damping applications over uniquely broad temperature ranges. In Society of Plastics Engineers - 66th Annual Technical Conference of the Society of Plastics Engineers, Plastics Encounter at ANTEC 2008 (Vol. 2, pp. 1296-1300)