Design of Stretchable Electronics Against Impact

J. H. Yuan*, M. Pharr, X. Feng, John A. Rogers, Yonggang Huang

*Corresponding author for this work

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

Stretchable electronics offer soft, biocompatible mechanical properties; these same properties make them susceptible to device failure associated with physical impact. This paper studies designs for stretchable electronics that resist failure from impacts due to incorporation of a viscoelastic encapsulation layer. Results indicate that the impact resistance depends on the thickness and viscoelastic properties of the encapsulation layer, as well as the duration of impact. An analytic model for the critical thickness of the encapsulation layer is established. It is shown that a commercially available, low modulus silicone material offers viscous properties that make it a good candidate as the encapsulation layer for stretchable electronics.

Original languageEnglish (US)
Article number101009
JournalJournal of Applied Mechanics, Transactions ASME
Volume83
Issue number10
DOIs
StatePublished - Oct 1 2016

Fingerprint

Encapsulation
Electronic equipment
electronics
impact resistance
Impact resistance
silicones
Silicones
mechanical properties
Mechanical properties

Keywords

  • impact loading
  • stretchable electronics
  • viscoelasticity

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

@article{5ee621175a4d4f2a850ec8395d426658,
title = "Design of Stretchable Electronics Against Impact",
abstract = "Stretchable electronics offer soft, biocompatible mechanical properties; these same properties make them susceptible to device failure associated with physical impact. This paper studies designs for stretchable electronics that resist failure from impacts due to incorporation of a viscoelastic encapsulation layer. Results indicate that the impact resistance depends on the thickness and viscoelastic properties of the encapsulation layer, as well as the duration of impact. An analytic model for the critical thickness of the encapsulation layer is established. It is shown that a commercially available, low modulus silicone material offers viscous properties that make it a good candidate as the encapsulation layer for stretchable electronics.",
keywords = "impact loading, stretchable electronics, viscoelasticity",
author = "Yuan, {J. H.} and M. Pharr and X. Feng and Rogers, {John A.} and Yonggang Huang",
year = "2016",
month = "10",
day = "1",
doi = "10.1115/1.4034226",
language = "English (US)",
volume = "83",
journal = "Journal of Applied Mechanics, Transactions ASME",
issn = "0021-8936",
publisher = "American Society of Mechanical Engineers(ASME)",
number = "10",

}

Design of Stretchable Electronics Against Impact. / Yuan, J. H.; Pharr, M.; Feng, X.; Rogers, John A.; Huang, Yonggang.

In: Journal of Applied Mechanics, Transactions ASME, Vol. 83, No. 10, 101009, 01.10.2016.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Design of Stretchable Electronics Against Impact

AU - Yuan, J. H.

AU - Pharr, M.

AU - Feng, X.

AU - Rogers, John A.

AU - Huang, Yonggang

PY - 2016/10/1

Y1 - 2016/10/1

N2 - Stretchable electronics offer soft, biocompatible mechanical properties; these same properties make them susceptible to device failure associated with physical impact. This paper studies designs for stretchable electronics that resist failure from impacts due to incorporation of a viscoelastic encapsulation layer. Results indicate that the impact resistance depends on the thickness and viscoelastic properties of the encapsulation layer, as well as the duration of impact. An analytic model for the critical thickness of the encapsulation layer is established. It is shown that a commercially available, low modulus silicone material offers viscous properties that make it a good candidate as the encapsulation layer for stretchable electronics.

AB - Stretchable electronics offer soft, biocompatible mechanical properties; these same properties make them susceptible to device failure associated with physical impact. This paper studies designs for stretchable electronics that resist failure from impacts due to incorporation of a viscoelastic encapsulation layer. Results indicate that the impact resistance depends on the thickness and viscoelastic properties of the encapsulation layer, as well as the duration of impact. An analytic model for the critical thickness of the encapsulation layer is established. It is shown that a commercially available, low modulus silicone material offers viscous properties that make it a good candidate as the encapsulation layer for stretchable electronics.

KW - impact loading

KW - stretchable electronics

KW - viscoelasticity

UR - http://www.scopus.com/inward/record.url?scp=84982104719&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84982104719&partnerID=8YFLogxK

U2 - 10.1115/1.4034226

DO - 10.1115/1.4034226

M3 - Article

VL - 83

JO - Journal of Applied Mechanics, Transactions ASME

JF - Journal of Applied Mechanics, Transactions ASME

SN - 0021-8936

IS - 10

M1 - 101009

ER -