Deterministically assembled three-dimensional silicon microstructures using elastomeric stamps

H. Keum*, A. Carlson, J. D. Eisenhaure, J. A. Rogers, S. Kim

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

This paper reports the deterministic assembly of microscale silicon objects which are thick (>10 μm) and of arbitrary shape using the elastomeric microtipped stamps. The deterministic assembly consists of the preparation and manipulation of microscale silicon objects. This micromanufacturing strategy, influenced by the microtipped stamp based transfer printing, enables the construction of complex three-dimensional silicon structures which would be difficult or impossible to create using other methods.

Original languageEnglish (US)
Title of host publication2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012
Pages224-227
Number of pages4
DOIs
StatePublished - May 7 2012
Event2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012 - Paris, France
Duration: Jan 29 2012Feb 2 2012

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

Other2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012
CountryFrance
CityParis
Period1/29/122/2/12

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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