Deterministically assembled three-dimensional silicon microstructures using elastomeric stamps

H. Keum; A. Carlson; J. D. Eisenhaure; J. A. Rogers; S. Kim

doi:10.1109/MEMSYS.2012.6170131

Deterministically assembled three-dimensional silicon microstructures using elastomeric stamps

H. Keum^*, A. Carlson, J. D. Eisenhaure, J. A. Rogers, S. Kim

^*Corresponding author for this work

Materials Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Scopus citations

Abstract

This paper reports the deterministic assembly of microscale silicon objects which are thick (>10 μm) and of arbitrary shape using the elastomeric microtipped stamps. The deterministic assembly consists of the preparation and manipulation of microscale silicon objects. This micromanufacturing strategy, influenced by the microtipped stamp based transfer printing, enables the construction of complex three-dimensional silicon structures which would be difficult or impossible to create using other methods.

Original language	English (US)
Title of host publication	2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012
Pages	224-227
Number of pages	4
DOIs	https://doi.org/10.1109/MEMSYS.2012.6170131
State	Published - May 7 2012
Event	2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012 - Paris, France Duration: Jan 29 2012 → Feb 2 2012

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)	1084-6999

Other

Other	2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012
Country/Territory	France
City	Paris
Period	1/29/12 → 2/2/12

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Mechanical Engineering
Electrical and Electronic Engineering

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10.1109/MEMSYS.2012.6170131

Cite this

Keum, H., Carlson, A., Eisenhaure, J. D., Rogers, J. A., & Kim, S. (2012). Deterministically assembled three-dimensional silicon microstructures using elastomeric stamps. In 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012 (pp. 224-227). Article 6170131 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2012.6170131

@inproceedings{1d996e72ca214b269f2b362c89ea155b,

title = "Deterministically assembled three-dimensional silicon microstructures using elastomeric stamps",

abstract = "This paper reports the deterministic assembly of microscale silicon objects which are thick (>10 μm) and of arbitrary shape using the elastomeric microtipped stamps. The deterministic assembly consists of the preparation and manipulation of microscale silicon objects. This micromanufacturing strategy, influenced by the microtipped stamp based transfer printing, enables the construction of complex three-dimensional silicon structures which would be difficult or impossible to create using other methods.",

author = "H. Keum and A. Carlson and Eisenhaure, {J. D.} and Rogers, {J. A.} and S. Kim",

year = "2012",

month = may,

day = "7",

doi = "10.1109/MEMSYS.2012.6170131",

language = "English (US)",

isbn = "9781467303248",

series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

pages = "224--227",

booktitle = "2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012",

note = "2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012 ; Conference date: 29-01-2012 Through 02-02-2012",

}

Keum, H, Carlson, A, Eisenhaure, JD, Rogers, JA & Kim, S 2012, Deterministically assembled three-dimensional silicon microstructures using elastomeric stamps. in 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012., 6170131, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), pp. 224-227, 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012, Paris, France, 1/29/12. https://doi.org/10.1109/MEMSYS.2012.6170131

Deterministically assembled three-dimensional silicon microstructures using elastomeric stamps. / Keum, H.; Carlson, A.; Eisenhaure, J. D. et al.
2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012. 2012. p. 224-227 6170131 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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T1 - Deterministically assembled three-dimensional silicon microstructures using elastomeric stamps

AU - Keum, H.

AU - Carlson, A.

AU - Eisenhaure, J. D.

AU - Rogers, J. A.

AU - Kim, S.

PY - 2012/5/7

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AB - This paper reports the deterministic assembly of microscale silicon objects which are thick (>10 μm) and of arbitrary shape using the elastomeric microtipped stamps. The deterministic assembly consists of the preparation and manipulation of microscale silicon objects. This micromanufacturing strategy, influenced by the microtipped stamp based transfer printing, enables the construction of complex three-dimensional silicon structures which would be difficult or impossible to create using other methods.

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T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

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BT - 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012

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Keum H, Carlson A, Eisenhaure JD, Rogers JA, Kim S. Deterministically assembled three-dimensional silicon microstructures using elastomeric stamps. In 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012. 2012. p. 224-227. 6170131. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). doi: 10.1109/MEMSYS.2012.6170131

Deterministically assembled three-dimensional silicon microstructures using elastomeric stamps

Abstract

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ASJC Scopus subject areas

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