Development of a multi-modal, flexible tactile sensing skin using polymer micromachining

J. Engel, J. Chen, Chang Liu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Scopus citations

Abstract

Inspired by the superior functionality of biological skin, we report a first multi-modal, flexible, and robust tactile sensing skin based on polymer substrates. The demonstrated device successfully incorporates multiple sensor modalities into a compact "node" for evaluating contact forces and film curvature, as well as the relative hardness, thermal conductivity, and temperature of the contacted object. Sensing is accomplished via thin film metal gold heaters, nickel RTDs (Resistance Temperature Device), and NiCr (nichrome) strain gauges. Built on a micromachined polyimide (DuPont Kapton HN200) film, the sensors provide qualitative measurements of contact object properties. Experimental characterization of the sensors' performance presented.

Original languageEnglish (US)
Title of host publicationTRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1027-1030
Number of pages4
ISBN (Electronic)0780377311, 9780780377318
DOIs
StatePublished - 2003
Event12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers - Boston, United States
Duration: Jun 8 2003Jun 12 2003

Publication series

NameTRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers
Volume2

Other

Other12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers
CountryUnited States
CityBoston
Period6/8/036/12/03

Keywords

  • Biosensors
  • Micromachining
  • Polymers
  • Robustness
  • Sensor phenomena and characterization
  • Skin
  • Substrates
  • Temperature sensors
  • Thermal conductivity
  • Thermal sensors

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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