Development of an end-point detector for parylene deposition process

Wongso Sutomo; Xuefeng Wang; David Bullen; Sarah K. Braden; Chang Liu

doi:10.1109/JMEMS.2002.807473

Development of an end-point detector for parylene deposition process

Wongso Sutomo, Xuefeng Wang, David Bullen, Sarah K. Braden, Chang Liu^*

^*Corresponding author for this work

Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

7 Scopus citations

Abstract

Parylene is an emerging material for MEMS. It is an organic material that is grown by using the chemical vapor deposition method at room temperature. The deposition thickness is commonly controlled by the amount of solid-phase dimer loaded in a sublimation chamber. In a conventional deposition machine, the end point of the process is designated by the moment the dimer is exhausted. However, this end-of-process criterion does not offer precise, repeatable control of film thickness. We present the results of the development of an in situ end-point detector for a Parylene chemical vapor deposition process. The detector is based on the thermal transfer principle and can be implemented on commercial Parylene deposition systems with minimal system modification. Such a sensor enables a user to stop the deposition when a targeted thickness is reached. The end point detector is very simple to implement on existing Parylene deposition systems. A series of such sensors with different target deposition thickness would allow extraction of the actual deposition rate within a deposition run.

Original language	English (US)
Pages (from-to)	64-69
Number of pages	6
Journal	Journal of Microelectromechanical Systems
Volume	12
Issue number	1
DOIs	https://doi.org/10.1109/JMEMS.2002.807473
State	Published - Feb 2003

Funding

Manuscript received February 12, 2002; revised August 28, 2002. This work is supported by the National Science Foundation (NSF) CAREER award to C. Liu. Subject Editor H. Fujita. W. Sutomo, X. Wang, and D. Bullen are with the Micro Actuators, Sensors and Systems Group Micro and Nanotechnology Laboratory University of Illinois at Urbana-Champaign Champaign, IL 61801 USA. S. K. Braden is with the Department of Electrical Engineering, Stanford University, Palo Alto, CA 94305 USA. C. Liu is with the Micro and Nanotechnology Laboratory, Urbana, IL 61801 USA (e-mail: [email protected]). Digital Object Identifier 10.1109/JMEMS.2002.807473 Fig. 1. Actual measured Parylene thickness as a function of amount of dimer used. Each data point represents one actual deposition run conducted at our laboratory.

ASJC Scopus subject areas

Mechanical Engineering
Electrical and Electronic Engineering

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10.1109/JMEMS.2002.807473

Cite this

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title = "Development of an end-point detector for parylene deposition process",

abstract = "Parylene is an emerging material for MEMS. It is an organic material that is grown by using the chemical vapor deposition method at room temperature. The deposition thickness is commonly controlled by the amount of solid-phase dimer loaded in a sublimation chamber. In a conventional deposition machine, the end point of the process is designated by the moment the dimer is exhausted. However, this end-of-process criterion does not offer precise, repeatable control of film thickness. We present the results of the development of an in situ end-point detector for a Parylene chemical vapor deposition process. The detector is based on the thermal transfer principle and can be implemented on commercial Parylene deposition systems with minimal system modification. Such a sensor enables a user to stop the deposition when a targeted thickness is reached. The end point detector is very simple to implement on existing Parylene deposition systems. A series of such sensors with different target deposition thickness would allow extraction of the actual deposition rate within a deposition run.",

author = "Wongso Sutomo and Xuefeng Wang and David Bullen and Braden, {Sarah K.} and Chang Liu",

note = "Funding Information: Manuscript received February 12, 2002; revised August 28, 2002. This work is supported by the National Science Foundation (NSF) CAREER award to C. Liu. Subject Editor H. Fujita. W. Sutomo, X. Wang, and D. Bullen are with the Micro Actuators, Sensors and Systems Group Micro and Nanotechnology Laboratory University of Illinois at Urbana-Champaign Champaign, IL 61801 USA. S. K. Braden is with the Department of Electrical Engineering, Stanford University, Palo Alto, CA 94305 USA. C. Liu is with the Micro and Nanotechnology Laboratory, Urbana, IL 61801 USA (e-mail: [email protected]). Digital Object Identifier 10.1109/JMEMS.2002.807473 Fig. 1. Actual measured Parylene thickness as a function of amount of dimer used. Each data point represents one actual deposition run conducted at our laboratory.",

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N1 - Funding Information: Manuscript received February 12, 2002; revised August 28, 2002. This work is supported by the National Science Foundation (NSF) CAREER award to C. Liu. Subject Editor H. Fujita. W. Sutomo, X. Wang, and D. Bullen are with the Micro Actuators, Sensors and Systems Group Micro and Nanotechnology Laboratory University of Illinois at Urbana-Champaign Champaign, IL 61801 USA. S. K. Braden is with the Department of Electrical Engineering, Stanford University, Palo Alto, CA 94305 USA. C. Liu is with the Micro and Nanotechnology Laboratory, Urbana, IL 61801 USA (e-mail: [email protected]). Digital Object Identifier 10.1109/JMEMS.2002.807473 Fig. 1. Actual measured Parylene thickness as a function of amount of dimer used. Each data point represents one actual deposition run conducted at our laboratory.

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N2 - Parylene is an emerging material for MEMS. It is an organic material that is grown by using the chemical vapor deposition method at room temperature. The deposition thickness is commonly controlled by the amount of solid-phase dimer loaded in a sublimation chamber. In a conventional deposition machine, the end point of the process is designated by the moment the dimer is exhausted. However, this end-of-process criterion does not offer precise, repeatable control of film thickness. We present the results of the development of an in situ end-point detector for a Parylene chemical vapor deposition process. The detector is based on the thermal transfer principle and can be implemented on commercial Parylene deposition systems with minimal system modification. Such a sensor enables a user to stop the deposition when a targeted thickness is reached. The end point detector is very simple to implement on existing Parylene deposition systems. A series of such sensors with different target deposition thickness would allow extraction of the actual deposition rate within a deposition run.

AB - Parylene is an emerging material for MEMS. It is an organic material that is grown by using the chemical vapor deposition method at room temperature. The deposition thickness is commonly controlled by the amount of solid-phase dimer loaded in a sublimation chamber. In a conventional deposition machine, the end point of the process is designated by the moment the dimer is exhausted. However, this end-of-process criterion does not offer precise, repeatable control of film thickness. We present the results of the development of an in situ end-point detector for a Parylene chemical vapor deposition process. The detector is based on the thermal transfer principle and can be implemented on commercial Parylene deposition systems with minimal system modification. Such a sensor enables a user to stop the deposition when a targeted thickness is reached. The end point detector is very simple to implement on existing Parylene deposition systems. A series of such sensors with different target deposition thickness would allow extraction of the actual deposition rate within a deposition run.

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Development of an end-point detector for parylene deposition process

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