Development of interconnection materials for Bi2Te3 and PbTe thermoelectric module by using SLID technique

C. C. Li*, S. J. Hsu, C. C. Lee, L. L. Liao, M. J. Dai, C. K. Liu, Z. X. Zhu, H. W. Yang, J. H. Ke, C. Robert Kao, G. J. Snyder

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

In this study, low-temperature Bi2Te3 and mid-temperature PbTe thermoelectric modules are assembled by the technique of Solid Liquid Interdiffusion (SLID). Scanning electron microscope is carried out for issues relating to factors limiting the reliability, growth of intermetallic compounds, and thermal stability. For low-temperature thermoelectric module, N-type Bi2Te3 is bonded to alumina substrates by using a Ni/Sn/Ag system. During bonding and subsequent aging reaction at 200 °C, Sn reacts with Ag to form Ag3Sn, and Ni reacts with Sn to form Ni3Sn4. This reaction process takes less than 72 h to exhaust the entire Sn layer to produce a bonding that can withstand temperature as high as 480 °C. The interfacial reaction, Ni penetration depth, and IMC kinetics between Ni and Bi2Te3 at 200, 250, and 300 °C are also investigated in detail. For mid-temperature thermoelectric module, N-type PbTe is bonded to alumina substrates by using a Ag/In/Ag system. During assembly at 190 °C, all Ag/In/Ag joint are transformed into Ag2In, which has the melting temperature above 670 °C, in less than 2 minutes. Furthermore, this Ag-In joint has passed high temperature storage test at 400 °C for 1000 h. The success of solid liquid interdiffusion technique and related contact materials provide a cost effective way to assemble thermoelectric modules for power generating or cooling applications which require long term operations at high temperatures.

Original languageEnglish (US)
Title of host publication2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1470-1476
Number of pages7
Volume2015-July
ISBN (Electronic)9781479986095
DOIs
StatePublished - Jan 1 2015
Event2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015 - San Diego, United States
Duration: May 26 2015May 29 2015

Other

Other2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015
CountryUnited States
CitySan Diego
Period5/26/155/29/15

Keywords

  • High Temperature Storage
  • Interfacial Reaction
  • Solid Liquid Interdiffusion technique
  • Thermoelectric module

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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