Development of two-dimensional scanning probe arrays for Dip-pen Nanolithography (DPN)

Jun Zou*, Xuefeng Wang, David Bullen, Chang Liu, Chad Mirkin

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

In this paper, we report the development of two-dimensional scanning probe arrays to achieve high-throughput DPN writing in a parallel mode. A new "mold-and-transfer" micromachining process has been developed, which is capable of making large scanning probe arrays with high yield and at low cost. Up to date, two-dimensional passive probe arrays with 1000 metal probes and 1000,000 polymer probes have been successfully developed. Prototypes of two-dimensional active probe arrays have also been successfully fabricated and tested, which consists of 49 scanning probe individually controlled by a thermal bimorph micro actuator integrated on each probe. To ensure proper contact status of each probe on the sample surface, a new electrical probe-substrate contact sensing method has also been developed for two-dimensional DPN probe arrays to realize robust DPN writing. As such, 2D DPN writing has been successfully demonstrated for the first time.

Original languageEnglish (US)
Title of host publicationMicro (MEMS) and Nanotechnologies for Space Applications
DOIs
StatePublished - Sep 14 2006
EventMicro (MEMS) and Nanotechnologies for Space Applications - Kissimmee, FL, United States
Duration: Apr 19 2006Apr 20 2006

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume6223
ISSN (Print)0277-786X

Other

OtherMicro (MEMS) and Nanotechnologies for Space Applications
CountryUnited States
CityKissimmee, FL
Period4/19/064/20/06

Keywords

  • Dip-pen nanolithography
  • Nanofabrication
  • Nanopatterning
  • Scanning probe

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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