Development of ultra-low impedance Through-wafer Micro-vias

F. M. Finkbeiner*, C. Adams, E. Apodaca, J. A. Chervenak, J. Fischer, N. Doan, M. J. Li, C. K. Stahle, R. P. Brekosky, S. R. Bandler, E. Figueroa-Feliciano, M. A. Lindeman, R. L. Kelley, T. Saab, D. J. Talley

*Corresponding author for this work

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