Diffusion and phase transformations during interfacial reaction between lead-tin solders and palladium

G. Ghosh*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

19 Scopus citations

Abstract

The interfacial reaction between Pb-Sn solders and bulk Pd substrate is studied both in the liquid- and solid-state of the solder. The interfacial microstructures are characterized by imaging and energy dispersive x-ray analysis in scanning electron microscope. The correlation between the diffusion path and interfacial microstructure in 62Sn38Pb/Pd, 95Pb5Sn/Pd, and Pb/Pd diffusion couples is demonstrated by means of calculated isothermal sections of the Pb-Sn-Pd system and the metastable phase diagram of the Pb-Pd system.

Original languageEnglish (US)
Pages (from-to)1154-1160
Number of pages7
JournalJournal of Electronic Materials
Volume27
Issue number11
DOIs
StatePublished - Nov 1998

Keywords

  • Diffusion path
  • Interdiffusion
  • Interfacial reaction
  • Intermetallic
  • Palladium
  • Solder

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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