Diffusion and phase transformations during interfacial reaction between lead-tin solders and palladium

G. Ghosh

doi:10.1007/s11664-998-0064-9

Diffusion and phase transformations during interfacial reaction between lead-tin solders and palladium

G. Ghosh^*

^*Corresponding author for this work

Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

19 Scopus citations

Abstract

The interfacial reaction between Pb-Sn solders and bulk Pd substrate is studied both in the liquid- and solid-state of the solder. The interfacial microstructures are characterized by imaging and energy dispersive x-ray analysis in scanning electron microscope. The correlation between the diffusion path and interfacial microstructure in 62Sn38Pb/Pd, 95Pb5Sn/Pd, and Pb/Pd diffusion couples is demonstrated by means of calculated isothermal sections of the Pb-Sn-Pd system and the metastable phase diagram of the Pb-Pd system.

Original language	English (US)
Pages (from-to)	1154-1160
Number of pages	7
Journal	Journal of Electronic Materials
Volume	27
Issue number	11
DOIs	https://doi.org/10.1007/s11664-998-0064-9
State	Published - Nov 1998

Keywords

Diffusion path
Interdiffusion
Interfacial reaction
Intermetallic
Palladium
Solder

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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10.1007/s11664-998-0064-9

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title = "Diffusion and phase transformations during interfacial reaction between lead-tin solders and palladium",

abstract = "The interfacial reaction between Pb-Sn solders and bulk Pd substrate is studied both in the liquid- and solid-state of the solder. The interfacial microstructures are characterized by imaging and energy dispersive x-ray analysis in scanning electron microscope. The correlation between the diffusion path and interfacial microstructure in 62Sn38Pb/Pd, 95Pb5Sn/Pd, and Pb/Pd diffusion couples is demonstrated by means of calculated isothermal sections of the Pb-Sn-Pd system and the metastable phase diagram of the Pb-Pd system.",

keywords = "Diffusion path, Interdiffusion, Interfacial reaction, Intermetallic, Palladium, Solder",

author = "G. Ghosh",

note = "Funding Information: This work was supported by the Semiconductor Research Corporation (Grant # 447G, Grant Monitor: Dr. Ron Bracken) and the National Science Foundation (Grant # DMR-9523447).",

year = "1998",

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doi = "10.1007/s11664-998-0064-9",

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T1 - Diffusion and phase transformations during interfacial reaction between lead-tin solders and palladium

AU - Ghosh, G.

N1 - Funding Information: This work was supported by the Semiconductor Research Corporation (Grant # 447G, Grant Monitor: Dr. Ron Bracken) and the National Science Foundation (Grant # DMR-9523447).

PY - 1998/11

Y1 - 1998/11

N2 - The interfacial reaction between Pb-Sn solders and bulk Pd substrate is studied both in the liquid- and solid-state of the solder. The interfacial microstructures are characterized by imaging and energy dispersive x-ray analysis in scanning electron microscope. The correlation between the diffusion path and interfacial microstructure in 62Sn38Pb/Pd, 95Pb5Sn/Pd, and Pb/Pd diffusion couples is demonstrated by means of calculated isothermal sections of the Pb-Sn-Pd system and the metastable phase diagram of the Pb-Pd system.

AB - The interfacial reaction between Pb-Sn solders and bulk Pd substrate is studied both in the liquid- and solid-state of the solder. The interfacial microstructures are characterized by imaging and energy dispersive x-ray analysis in scanning electron microscope. The correlation between the diffusion path and interfacial microstructure in 62Sn38Pb/Pd, 95Pb5Sn/Pd, and Pb/Pd diffusion couples is demonstrated by means of calculated isothermal sections of the Pb-Sn-Pd system and the metastable phase diagram of the Pb-Pd system.

KW - Diffusion path

KW - Interdiffusion

KW - Interfacial reaction

KW - Intermetallic

KW - Palladium

KW - Solder

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JO - Journal of Electronic Materials

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Diffusion and phase transformations during interfacial reaction between lead-tin solders and palladium

Abstract

Keywords

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