Direct-write scanning probe lithography: Towards a desktop fab

Louise R. Giam, Andrew J. Senesi, Xing Liao, Lu Shin Wong, Jinan Chai, Daniel J. Eichelsdoerfer, Wooyoung Shim, Boris Rasin, Shu He, Chad A. Mirkin

Research output: Chapter in Book/Report/Conference proceedingConference contribution


Massively parallel scanning-probe based methods have been used to address the challenges of nanometer to millimeter scale printing for a variety of materials and mark a step towards the realization of a "desktop fab." Such tools enable simple, flexible, high-throughput, and low-cost nano- and microscale patterning, which allow researchers to rapidly synthesize and study systems ranging from nanoparticle synthesis to biological processes. We have developed a novel scanning probe-based cantilever-free printing method termed polymer pen lithography (PPL), which uses an array of elastomeric tips to transfer materials (e.g. alkanethiols, proteins, polymers) in a direct-write manner onto a variety of surfaces. This technique takes the best attributes of dip-pen nanolithography (DPN) and eliminates many of the disadvantages of contact printing. Various related techniques such as beam pen lithography (BPL), scanning probe block copolymer lithography (SPBCL), and hard-tip, soft spring lithography (HSL) are also discussed.

Original languageEnglish (US)
Title of host publicationMicro- and Nanotechnology Sensors, Systems, and Applications III
StatePublished - 2011
EventMicro- and Nanotechnology Sensors, Systems, and Applications III - Orlando, FL, United States
Duration: Apr 25 2011Apr 29 2011

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)0277-786X


OtherMicro- and Nanotechnology Sensors, Systems, and Applications III
Country/TerritoryUnited States
CityOrlando, FL


  • direct-write
  • lithography
  • massively parallel
  • scanning probe

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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