Dynamic modelling of the cusp error reduction phenomenon in high speed micro/meso-scale milling processes with ultrasonic vibration assistance

J. H. Ko*, K. C. Shaw, Kornel Ehmann

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A simulation methodology is proposed to understand and illustrate the surface quality improvement phenomena in precision micro/meso scale milling processes with ultrasonic vibration-assistance as well as the influence of the motion parameters on the topography of the generated surfaces. In the simulation of the machined surface generation process, the trochoidal cutting edge motion is dynamically tracked considering the feed per tooth, cutter runout, deflection, and ultrasonic vibration assistance. The feed per tooth influences the interval between consecutive cutting edge positions on the machined surface, which results in cusps. In addition to this, the cusp geometry is altered by cutter deflection and runout. The machined surface topography can be simulated from the continuous cutting edge motions with and without ultrasonic vibration-assistance. The ultrasonic vibration motion enables an overlap between successive cutting trajectories leading to their intrusion into the previously generated cusp. This leads to an array of possible surface topographies and better surface roughness.

Original languageEnglish (US)
Title of host publicationProceedings of the 11th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2011
Publishereuspen
Pages192-195
Number of pages4
Volume2
ISBN (Electronic)9780955308291
StatePublished - Jan 1 2011
Event11th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2011 - Como, Italy
Duration: May 23 2011May 26 2011

Other

Other11th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2011
CountryItaly
CityComo
Period5/23/115/26/11

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Mechanical Engineering
  • Materials Science(all)
  • Instrumentation
  • Environmental Engineering

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