Effects of palladium and solder aging on mechanical and fatigue properties of tin-lead eutectic solder

S. Vaynman; G. Ghosh; M. E. Fine

doi:10.1007/s11664-998-0073-8

Effects of palladium and solder aging on mechanical and fatigue properties of tin-lead eutectic solder

S. Vaynman^*, G. Ghosh, M. E. Fine

^*Corresponding author for this work

Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

18 Scopus citations

Abstract

The effects of (a) 0.5 wt.% of Pd addition, and (b) aging on mechanical and fatigue properties of eutectic solder (63Sn37Pb) were investigated. The creep rate of eutectic solder at room temperature is not affected by Pd addition. However, at 80°C, solder containing Pd creeps slower than Sn-Pb eutectic. Strain rate dramatically affects yield and tensile stress of eutectic solder with Pd as it does for the binary solder. Isothermal fatigue life of solder at 25°C is essentially not changed by Pd addition. The microstructure of Pd-containing solder consisted of polyhedral grains of (Pb), (Sn), and a dispersion of PdSn₄ intermetallic. Significant microstructural changes and interphase interface phenomena take place during creep deformation at 25 and 80°C. Ambient aging for seven years leads to solder softening and to moderate increase in isothermal fatigue life.

Original language	English (US)
Pages (from-to)	1223-1228
Number of pages	6
Journal	Journal of Electronic Materials
Volume	27
Issue number	11
DOIs	https://doi.org/10.1007/s11664-998-0073-8
State	Published - Nov 1998

Keywords

Creep
Eutectic tin-lead
Isothermal fatigue
Palladium addition
Solder
Tensile properties

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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10.1007/s11664-998-0073-8

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@article{2cc58a5c2f394332be8f094bc4fac52d,

title = "Effects of palladium and solder aging on mechanical and fatigue properties of tin-lead eutectic solder",

abstract = "The effects of (a) 0.5 wt.% of Pd addition, and (b) aging on mechanical and fatigue properties of eutectic solder (63Sn37Pb) were investigated. The creep rate of eutectic solder at room temperature is not affected by Pd addition. However, at 80°C, solder containing Pd creeps slower than Sn-Pb eutectic. Strain rate dramatically affects yield and tensile stress of eutectic solder with Pd as it does for the binary solder. Isothermal fatigue life of solder at 25°C is essentially not changed by Pd addition. The microstructure of Pd-containing solder consisted of polyhedral grains of (Pb), (Sn), and a dispersion of PdSn4 intermetallic. Significant microstructural changes and interphase interface phenomena take place during creep deformation at 25 and 80°C. Ambient aging for seven years leads to solder softening and to moderate increase in isothermal fatigue life.",

keywords = "Creep, Eutectic tin-lead, Isothermal fatigue, Palladium addition, Solder, Tensile properties",

author = "S. Vaynman and G. Ghosh and Fine, {M. E.}",

note = "Funding Information: This work was supported by the Semiconductor Research Corporation.",

year = "1998",

month = nov,

doi = "10.1007/s11664-998-0073-8",

language = "English (US)",

volume = "27",

pages = "1223--1228",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer New York",

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TY - JOUR

T1 - Effects of palladium and solder aging on mechanical and fatigue properties of tin-lead eutectic solder

AU - Vaynman, S.

AU - Ghosh, G.

AU - Fine, M. E.

N1 - Funding Information: This work was supported by the Semiconductor Research Corporation.

PY - 1998/11

Y1 - 1998/11

N2 - The effects of (a) 0.5 wt.% of Pd addition, and (b) aging on mechanical and fatigue properties of eutectic solder (63Sn37Pb) were investigated. The creep rate of eutectic solder at room temperature is not affected by Pd addition. However, at 80°C, solder containing Pd creeps slower than Sn-Pb eutectic. Strain rate dramatically affects yield and tensile stress of eutectic solder with Pd as it does for the binary solder. Isothermal fatigue life of solder at 25°C is essentially not changed by Pd addition. The microstructure of Pd-containing solder consisted of polyhedral grains of (Pb), (Sn), and a dispersion of PdSn4 intermetallic. Significant microstructural changes and interphase interface phenomena take place during creep deformation at 25 and 80°C. Ambient aging for seven years leads to solder softening and to moderate increase in isothermal fatigue life.

AB - The effects of (a) 0.5 wt.% of Pd addition, and (b) aging on mechanical and fatigue properties of eutectic solder (63Sn37Pb) were investigated. The creep rate of eutectic solder at room temperature is not affected by Pd addition. However, at 80°C, solder containing Pd creeps slower than Sn-Pb eutectic. Strain rate dramatically affects yield and tensile stress of eutectic solder with Pd as it does for the binary solder. Isothermal fatigue life of solder at 25°C is essentially not changed by Pd addition. The microstructure of Pd-containing solder consisted of polyhedral grains of (Pb), (Sn), and a dispersion of PdSn4 intermetallic. Significant microstructural changes and interphase interface phenomena take place during creep deformation at 25 and 80°C. Ambient aging for seven years leads to solder softening and to moderate increase in isothermal fatigue life.

KW - Creep

KW - Eutectic tin-lead

KW - Isothermal fatigue

KW - Palladium addition

KW - Solder

KW - Tensile properties

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U2 - 10.1007/s11664-998-0073-8

DO - 10.1007/s11664-998-0073-8

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AN - SCOPUS:0032207028

SN - 0361-5235

VL - 27

SP - 1223

EP - 1228

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 11

ER -

Effects of palladium and solder aging on mechanical and fatigue properties of tin-lead eutectic solder

Abstract

Keywords

ASJC Scopus subject areas

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