Abstract
Ultrasonic vibration cutting is an efficient cutting process for mechanical micro-machining. This process can generate intricate surface textures with different geometric characteristics. Micro-grooves/micro-channels are among the most frequently encountered micro-structures and, as such, are the focus of this paper. The effectiveness of both the linear and ultrasonic elliptical vibration-assisted machining technique in micro-groove turning is analyzed and discussed in the paper. The paper first investigates the mechanisms of micro-groove generation induced by the linear and elliptical vibration modes. A simplified cutting force analysis method is given to compare the effectiveness of the two modes in micro-groove turning. The surface roughness of the generated micro-grooves is analyzed next and theoretical expressions are given for the two cases. Finally, micro-groove turning experiments are conducted to compare the influences of the two vibration modes on the cutting forces and the surface roughness. The experimental results show that linear vibration-assisted micro-groove turning leads to better surface roughness as compared to the elliptical vibration-assisted case, while elliptical vibration-assisted micro-groove turning shows advantages in terms of decreasing the cutting forces.
Original language | English (US) |
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Pages (from-to) | 30-40 |
Number of pages | 11 |
Journal | Ultrasonics |
Volume | 67 |
DOIs | |
State | Published - Apr 2016 |
Funding
This work was supported by the National Science & Technology Major Project of China under Grant number 2013ZX04001-021 , by China Postdoctoral Science Foundation (No. 2015M570447 ) and by the Fundamental Research Funds for the Central Universities (No. NS2016048 ). The first author was also grateful for the financial supports from the Chinese Scholarship Council and Nanjing University of Aeronautics and Astronautics , China.
Keywords
- Cutting forces
- Micro-groove
- Surface roughness
- Turning process
- Ultrasonic vibration cutting
ASJC Scopus subject areas
- Acoustics and Ultrasonics