Effects of vibration trajectory on ductile-to-brittle transition in vibration cutting of single crystal silicon using a non-resonant tool

Jianjian Wang, Yang Yang, Ping Guo*

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

8 Scopus citations

Abstract

Vibration-assisted cutting that utilizes a time-varying cutting trajectory has showed superior performance in ductile-mode cutting of various brittle materials, such as glass and cemented carbide. The knowledge regarding the ductile-to-brittle transition condition is a fundamental issue to regulate and ensure high surface integrity in ductile-mode cutting of brittle materials. Specifically, in vibration cutting of brittle materials, the vibration trajectory has a critical influence on the ductile-to-brittle transition. Due to the anisotropy of material property with respect to the cutting direction, the ductile-to-brittle transition of single crystal silicon in vibration cutting is rather complicated. This study focuses on the study of the ductile-to-brittle transition in single crystal silicon considering the effects of the design of tool vibration trajectories. A non-resonant vibration tool thus has been developed to generate various kinds of two-dimensional tool trajectories, such as elliptical and trapezoidal shapes. The effects of trajectory shape on the nominal depth-of-cut are analyzed experimentally in this preliminary study.

Original languageEnglish (US)
Pages (from-to)289-292
Number of pages4
JournalProcedia CIRP
Volume71
DOIs
StatePublished - 2018
Event4th CIRP Conference on Surface Integrity, CIRP CSI 2018 - Tianjin, China
Duration: Jul 11 2018Jul 13 2018

Keywords

  • Ductile-to-brittle transition
  • Single crystal silicon
  • Vibration cutting

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Industrial and Manufacturing Engineering

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