@inproceedings{ecc4ffa2b30d4fdfb705c2c37baa5b05,
title = "Electric field assisted placement of carbon nanotubes using sacrificial graphene electrodes",
abstract = "Here we detail a complete process flow to overcome the challenge of placement of carbon nanotubes on solid surfaces, limiting {"}bottom-up{"}, large-scale integration in semiconductor process technology. To date most bottom up placement strategies are based on surface functionalization having the drawback that chemical modifications can deteriorate the deposited carbon nanotubes. The application of dielectrophoretic techniques eliminates the chemical treatment, however, it necessitates the usage of conductive electrodes typically made out of metal. These metallic electrodes limit performance, scaling, and density of integrated electronic devices. Here, we report a method for electric-field assisted placement of purely semiconducting carbon nanotubes from solution at predefined locations by means of large-scale graphene layers having patterned nanoscale deposition sites. The patterned graphene layers can be removed residue-free after carbon nanotube deposition. In order to demonstrate the application potential, we have assembled at predefined substrate locations carbon nanotubes of varying density and integrated them into field-effect transistor. The graphene-based placement process, implemented with nanoscale resolution at wafer scale, could enable mass manufacturing of application-specific electronics based on carbon nanotubes.",
keywords = "Carbon nanotubes, Dielectrophoresis, Graphene, Nanoelectronics, Placement",
author = "M. Engel and Farmer, {D. B.} and Azpiroz, {J. Tirapu} and Seo, {J. W.T.} and J. Kang and P. Avouris and Hersam, {M. C.} and R. Krupke and M. Steiner",
note = "Publisher Copyright: {\textcopyright} 2018 TechConnect. All rights reserved. Copyright: Copyright 2018 Elsevier B.V., All rights reserved.; 11th Annual TechConnect World Innovation Conference and Expo, Held Jointly with the 20th Annual Nanotech Conference and Expo,the 2018 SBIR/STTR Spring Innovation Conference, and the Defense TechConnect DTC Spring Conference ; Conference date: 13-05-2018 Through 16-05-2018",
year = "2018",
language = "English (US)",
series = "TechConnect Briefs 2018 - Advanced Materials",
publisher = "TechConnect",
pages = "54--57",
editor = "Matthew Laudon and Fiona Case and Fiona Case and Bart Romanowicz",
booktitle = "TechConnect Briefs 2018 - Advanced Materials",
}