Electrical resistivity of Cu and Nb thin films and multilayers

M. Fenn; A. K. Petford-Long; P. E. Donovan

doi:10.1016/S0304-8853(98)01062-2

Electrical resistivity of Cu and Nb thin films and multilayers

M. Fenn^*, A. K. Petford-Long, P. E. Donovan

^*Corresponding author for this work

Materials Science and Engineering

Research output: Contribution to journal › Conference article › peer-review

13 Scopus citations

Abstract

We have measured the resistivity, temperature coefficient of resistivity (TCR) and grain sizes in single films of Cu and Nb as a function of film thickness. We have compared our experimental results with the predictions of the theory due to Dimmich. This theory allows us to extract a value for grain boundary reflectivity, R, which is subsequently used in the analysis of the resistivity and TCR of Cu/Nb multilayers. We present our values for grain boundary reflectivity and the subsequent fit to the experimental resistivity and TCR using Dimmich's equations.

Original language	English (US)
Pages (from-to)	231-232
Number of pages	2
Journal	Journal of Magnetism and Magnetic Materials
Volume	198
DOIs	https://doi.org/10.1016/S0304-8853(98)01062-2
State	Published - Jun 1 1999
Event	Proceedings of the 1998 3rd International Symposium on Metallic Multilayers (MML-98) - Vancouver, BC, Can Duration: Jun 14 1998 → Jun 19 1998

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics

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10.1016/S0304-8853(98)01062-2

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@article{1e9d5a0396cc44fb9171b2996f38f3f1,

title = "Electrical resistivity of Cu and Nb thin films and multilayers",

abstract = "We have measured the resistivity, temperature coefficient of resistivity (TCR) and grain sizes in single films of Cu and Nb as a function of film thickness. We have compared our experimental results with the predictions of the theory due to Dimmich. This theory allows us to extract a value for grain boundary reflectivity, R, which is subsequently used in the analysis of the resistivity and TCR of Cu/Nb multilayers. We present our values for grain boundary reflectivity and the subsequent fit to the experimental resistivity and TCR using Dimmich's equations.",

author = "M. Fenn and Petford-Long, {A. K.} and Donovan, {P. E.}",

note = "Funding Information: We gratefully acknowledge the work of Dr. G. Akuetey. This research has been supported by EPSRC.; Proceedings of the 1998 3rd International Symposium on Metallic Multilayers (MML-98) ; Conference date: 14-06-1998 Through 19-06-1998",

year = "1999",

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doi = "10.1016/S0304-8853(98)01062-2",

language = "English (US)",

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TY - JOUR

T1 - Electrical resistivity of Cu and Nb thin films and multilayers

AU - Fenn, M.

AU - Petford-Long, A. K.

AU - Donovan, P. E.

N1 - Funding Information: We gratefully acknowledge the work of Dr. G. Akuetey. This research has been supported by EPSRC.

PY - 1999/6/1

Y1 - 1999/6/1

N2 - We have measured the resistivity, temperature coefficient of resistivity (TCR) and grain sizes in single films of Cu and Nb as a function of film thickness. We have compared our experimental results with the predictions of the theory due to Dimmich. This theory allows us to extract a value for grain boundary reflectivity, R, which is subsequently used in the analysis of the resistivity and TCR of Cu/Nb multilayers. We present our values for grain boundary reflectivity and the subsequent fit to the experimental resistivity and TCR using Dimmich's equations.

AB - We have measured the resistivity, temperature coefficient of resistivity (TCR) and grain sizes in single films of Cu and Nb as a function of film thickness. We have compared our experimental results with the predictions of the theory due to Dimmich. This theory allows us to extract a value for grain boundary reflectivity, R, which is subsequently used in the analysis of the resistivity and TCR of Cu/Nb multilayers. We present our values for grain boundary reflectivity and the subsequent fit to the experimental resistivity and TCR using Dimmich's equations.

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UR - http://www.scopus.com/inward/citedby.url?scp=0032683142&partnerID=8YFLogxK

U2 - 10.1016/S0304-8853(98)01062-2

DO - 10.1016/S0304-8853(98)01062-2

M3 - Conference article

AN - SCOPUS:0032683142

SN - 0304-8853

VL - 198

SP - 231

EP - 232

JO - Journal of Magnetism and Magnetic Materials

JF - Journal of Magnetism and Magnetic Materials

T2 - Proceedings of the 1998 3rd International Symposium on Metallic Multilayers (MML-98)

Y2 - 14 June 1998 through 19 June 1998

ER -

Electrical resistivity of Cu and Nb thin films and multilayers

Abstract

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