Electrical resistivity of Cu and Nb thin films and multilayers

M. Fenn*, A. K. Petford-Long, P. E. Donovan

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

11 Scopus citations

Abstract

We have measured the resistivity, temperature coefficient of resistivity (TCR) and grain sizes in single films of Cu and Nb as a function of film thickness. We have compared our experimental results with the predictions of the theory due to Dimmich. This theory allows us to extract a value for grain boundary reflectivity, R, which is subsequently used in the analysis of the resistivity and TCR of Cu/Nb multilayers. We present our values for grain boundary reflectivity and the subsequent fit to the experimental resistivity and TCR using Dimmich's equations.

Original languageEnglish (US)
Pages (from-to)231-232
Number of pages2
JournalJournal of Magnetism and Magnetic Materials
Volume198
DOIs
StatePublished - Jun 1 1999
EventProceedings of the 1998 3rd International Symposium on Metallic Multilayers (MML-98) - Vancouver, BC, Can
Duration: Jun 14 1998Jun 19 1998

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

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