Electrically interconnected assemblies of microscale device components by printing and molding

Mo Joon Kim; Jongseung Yoon; Sang Il Park; John A. Rogers

doi:10.1063/1.3268464

Electrically interconnected assemblies of microscale device components by printing and molding

Mo Joon Kim, Jongseung Yoon, Sang Il Park, John A. Rogers

Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

8 Scopus citations

Abstract

This letter presents approaches for assembly and electrical interconnection of micro/nanoscale devices into functional systems with useful characteristics. Transfer printing techniques provide deterministic control over an assembly process that occurs prior to or simultaneously with a soft lithographic molding step that defines relief features in a receiving polymer. Filling these features with conducting materials that are processable in the form of liquids or pastes yields integrated interconnects and contacts aligned to the devices. Studies of the underlying aspects and application to representative systems in photovoltaics and solid state lighting indicators provide insights into the process and its practical use.

Original language	English (US)
Article number	214101
Journal	Applied Physics Letters
Volume	95
Issue number	21
DOIs	https://doi.org/10.1063/1.3268464
State	Published - 2009

Funding

We thank T. Banks for help in processing by use of facilities at the Frederick Seitz Materials Research Laboratory. This work is supported by the U.S. Department of Energy, Division of Materials Sciences under Award No. DE-FG02-07ER46471, through the Materials Research Laboratory and Center for Microanalysis of Materials (Grant No. DE-FG02-07ER46453) at the University of Illinois at Urbana-Champaign.

ASJC Scopus subject areas

Physics and Astronomy (miscellaneous)

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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10.1063/1.3268464

Cite this

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title = "Electrically interconnected assemblies of microscale device components by printing and molding",

abstract = "This letter presents approaches for assembly and electrical interconnection of micro/nanoscale devices into functional systems with useful characteristics. Transfer printing techniques provide deterministic control over an assembly process that occurs prior to or simultaneously with a soft lithographic molding step that defines relief features in a receiving polymer. Filling these features with conducting materials that are processable in the form of liquids or pastes yields integrated interconnects and contacts aligned to the devices. Studies of the underlying aspects and application to representative systems in photovoltaics and solid state lighting indicators provide insights into the process and its practical use.",

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Electrically interconnected assemblies of microscale device components by printing and molding

Abstract

Funding

ASJC Scopus subject areas

UN SDGs

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