Electrically interconnected assemblies of microscale device components by printing and molding

Mo Joon Kim, Jongseung Yoon, Sang Il Park, John A. Rogers

Research output: Contribution to journalArticle

8 Scopus citations

Abstract

This letter presents approaches for assembly and electrical interconnection of micro/nanoscale devices into functional systems with useful characteristics. Transfer printing techniques provide deterministic control over an assembly process that occurs prior to or simultaneously with a soft lithographic molding step that defines relief features in a receiving polymer. Filling these features with conducting materials that are processable in the form of liquids or pastes yields integrated interconnects and contacts aligned to the devices. Studies of the underlying aspects and application to representative systems in photovoltaics and solid state lighting indicators provide insights into the process and its practical use.

Original languageEnglish (US)
Article number214101
JournalApplied Physics Letters
Volume95
Issue number21
DOIs
StatePublished - Dec 14 2009

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Fingerprint Dive into the research topics of 'Electrically interconnected assemblies of microscale device components by printing and molding'. Together they form a unique fingerprint.

  • Cite this