Electrically interconnected assemblies of microscale device components by printing and molding

Mo Joon Kim, Jongseung Yoon, Sang Il Park, John A. Rogers

Research output: Contribution to journalArticlepeer-review

8 Scopus citations

Fingerprint

Dive into the research topics of 'Electrically interconnected assemblies of microscale device components by printing and molding'. Together they form a unique fingerprint.

Engineering

INIS

Chemistry

Material Science