Electronic-nanophotonic integration

Yadong Wang; Qian Wang; Chongyang Liu; Ng Doris; Yongqiang Wei; Yingyan Huang; Seng Tiong Ho

doi:10.1364/fio.2009.fwn2

Electronic-nanophotonic integration

Yadong Wang^*, Qian Wang, Chongyang Liu, Ng Doris, Yongqiang Wei, Yingyan Huang, Seng Tiong Ho

^*Corresponding author for this work

Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Nanophotonic integration of III-V on silicon based on top-down coupling is presented. Light can be coupled up for amplification/absorption or coupled down for passive processing. Interlayer wafer bonding for this integration is described.

Original language	English (US)
Title of host publication	Frontiers in Optics, FiO 2009
Publisher	Optical Society of America (OSA)
ISBN (Print)	9781557528780
DOIs	https://doi.org/10.1364/fio.2009.fwn2
State	Published - 2009
Event	Frontiers in Optics, FiO 2009 - San Jose, CA, United States Duration: Oct 11 2009 → Oct 15 2009

Publication series

Name	Optics InfoBase Conference Papers
ISSN (Electronic)	2162-2701

Other

Other	Frontiers in Optics, FiO 2009
Country/Territory	United States
City	San Jose, CA
Period	10/11/09 → 10/15/09

ASJC Scopus subject areas

Instrumentation
Atomic and Molecular Physics, and Optics

Access to Document

10.1364/fio.2009.fwn2

Cite this

@inproceedings{50327f72f6a646538624aa61672786f4,

title = "Electronic-nanophotonic integration",

abstract = "Nanophotonic integration of III-V on silicon based on top-down coupling is presented. Light can be coupled up for amplification/absorption or coupled down for passive processing. Interlayer wafer bonding for this integration is described.",

author = "Yadong Wang and Qian Wang and Chongyang Liu and Ng Doris and Yongqiang Wei and Yingyan Huang and Ho, {Seng Tiong}",

year = "2009",

doi = "10.1364/fio.2009.fwn2",

language = "English (US)",

isbn = "9781557528780",

series = "Optics InfoBase Conference Papers",

publisher = "Optical Society of America (OSA)",

booktitle = "Frontiers in Optics, FiO 2009",

note = "Frontiers in Optics, FiO 2009 ; Conference date: 11-10-2009 Through 15-10-2009",

}

TY - GEN

T1 - Electronic-nanophotonic integration

AU - Wang, Yadong

AU - Wang, Qian

AU - Liu, Chongyang

AU - Doris, Ng

AU - Wei, Yongqiang

AU - Huang, Yingyan

AU - Ho, Seng Tiong

PY - 2009

Y1 - 2009

N2 - Nanophotonic integration of III-V on silicon based on top-down coupling is presented. Light can be coupled up for amplification/absorption or coupled down for passive processing. Interlayer wafer bonding for this integration is described.

AB - Nanophotonic integration of III-V on silicon based on top-down coupling is presented. Light can be coupled up for amplification/absorption or coupled down for passive processing. Interlayer wafer bonding for this integration is described.

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UR - http://www.scopus.com/inward/citedby.url?scp=85088342260&partnerID=8YFLogxK

U2 - 10.1364/fio.2009.fwn2

DO - 10.1364/fio.2009.fwn2

M3 - Conference contribution

AN - SCOPUS:85088342260

SN - 9781557528780

T3 - Optics InfoBase Conference Papers

BT - Frontiers in Optics, FiO 2009

PB - Optical Society of America (OSA)

T2 - Frontiers in Optics, FiO 2009

Y2 - 11 October 2009 through 15 October 2009

ER -

Electronic-nanophotonic integration

Abstract

Publication series

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ASJC Scopus subject areas

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