Electronic-nanophotonic integration

Yadong Wang*, Qian Wang, Chongyang Liu, Ng Doris, Yongqiang Wei, Yingyan Huang, Seng Tiong Ho

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution


Nanophotonic integration of III-V on silicon based on top-down coupling is presented. Light can be coupled up for amplification/absorption or coupled down for passive processing. Interlayer wafer bonding for this integration is described.

Original languageEnglish (US)
Title of host publicationFrontiers in Optics, FiO 2009
PublisherOptical Society of America (OSA)
ISBN (Print)9781557528780
StatePublished - 2009
EventFrontiers in Optics, FiO 2009 - San Jose, CA, United States
Duration: Oct 11 2009Oct 15 2009

Publication series

NameOptics InfoBase Conference Papers
ISSN (Electronic)2162-2701


OtherFrontiers in Optics, FiO 2009
Country/TerritoryUnited States
CitySan Jose, CA

ASJC Scopus subject areas

  • Instrumentation
  • Atomic and Molecular Physics, and Optics


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