TY - GEN
T1 - Embedded thermoelectric coolers for semiconductor hot spot cooling
AU - Koester, David
AU - Venkatasubramanian, Rama
AU - Conner, Bob
AU - Snyder, G. Jeffrey
PY - 2006/12/22
Y1 - 2006/12/22
N2 - Advanced semiconductors continue to increase performance by increasing functional integration and clock speed. Not only is the total power consumption increasing, the power distribution is highly non-uniform over the die area. Continued reduction in design rules are likely to increase the non-uniformity of the power density as high-speed circuits that dissipate a large amount of power but consume a small amount of die area are surrounded by lower-speed circuits that dissipate little power but consume a larger die area. The high temperature of localized hot spots adversely affects product reliability, performance and yield. A promising approach for site-specific cooling of hot spots is use of an embedded thermoelectric cooler (eTEC). The thickness of super lattice thermoelectric material is typically less than 20μm, which provides very high heat flux (>300 W/cm 2). The eTEC can be unobtrusively integrated in the package between the die and heat spreader. On-demand, site-specific cooling and the high coefficient-of-performance (COP) of the eTEC minimize the active power required for cooling hot spots.
AB - Advanced semiconductors continue to increase performance by increasing functional integration and clock speed. Not only is the total power consumption increasing, the power distribution is highly non-uniform over the die area. Continued reduction in design rules are likely to increase the non-uniformity of the power density as high-speed circuits that dissipate a large amount of power but consume a small amount of die area are surrounded by lower-speed circuits that dissipate little power but consume a larger die area. The high temperature of localized hot spots adversely affects product reliability, performance and yield. A promising approach for site-specific cooling of hot spots is use of an embedded thermoelectric cooler (eTEC). The thickness of super lattice thermoelectric material is typically less than 20μm, which provides very high heat flux (>300 W/cm 2). The eTEC can be unobtrusively integrated in the package between the die and heat spreader. On-demand, site-specific cooling and the high coefficient-of-performance (COP) of the eTEC minimize the active power required for cooling hot spots.
KW - Embedded thermoelectric cooler
KW - Localized hot spot cooling
KW - Peltier cooling
KW - Thermoelectric
UR - http://www.scopus.com/inward/record.url?scp=33845580323&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=33845580323&partnerID=8YFLogxK
U2 - 10.1109/ITHERM.2006.1645384
DO - 10.1109/ITHERM.2006.1645384
M3 - Conference contribution
AN - SCOPUS:33845580323
SN - 0780395247
SN - 9780780395244
T3 - Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
SP - 491
EP - 496
BT - Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006
T2 - 10th Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006
Y2 - 30 May 2006 through 2 June 2006
ER -