Embedded thermoelectric coolers for semiconductor hot spot cooling

David Koester*, Rama Venkatasubramanian, Bob Conner, G. Jeffrey Snyder

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Scopus citations

Abstract

Advanced semiconductors continue to increase performance by increasing functional integration and clock speed. Not only is the total power consumption increasing, the power distribution is highly non-uniform over the die area. Continued reduction in design rules are likely to increase the non-uniformity of the power density as high-speed circuits that dissipate a large amount of power but consume a small amount of die area are surrounded by lower-speed circuits that dissipate little power but consume a larger die area. The high temperature of localized hot spots adversely affects product reliability, performance and yield. A promising approach for site-specific cooling of hot spots is use of an embedded thermoelectric cooler (eTEC). The thickness of super lattice thermoelectric material is typically less than 20μm, which provides very high heat flux (>300 W/cm 2). The eTEC can be unobtrusively integrated in the package between the die and heat spreader. On-demand, site-specific cooling and the high coefficient-of-performance (COP) of the eTEC minimize the active power required for cooling hot spots.

Original languageEnglish (US)
Title of host publicationTenth Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006
Pages491-496
Number of pages6
DOIs
StatePublished - Dec 22 2006
Event10th Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006 - San Diego, CA, United States
Duration: May 30 2006Jun 2 2006

Publication series

NameThermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
Volume2006

Other

Other10th Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006
CountryUnited States
CitySan Diego, CA
Period5/30/066/2/06

Keywords

  • Embedded thermoelectric cooler
  • Localized hot spot cooling
  • Peltier cooling
  • Thermoelectric

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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