Etching sharp tips from thin metallic wires for tuning-fork-based scanning probe microscopy

Patrick Wallace Krantz, Venkat Chandrasekhar

Research output: Contribution to journalArticle

Abstract

Sharp tips are critical for obtaining high resolution images in scanning probe microscopy (SPM), particularly in samples with large variations in topography. For tuning-fork-based SPM, such tips are commonly obtained by electrochemical etching of metallic wires (e.g., tungsten). Electrochemical etching of metallic wires is the preferred means of preparing tips for scanning tunneling microscopy (STM), and techniques for obtaining sharp tips have been investigated extensively. However, the requirements for STM and tuning-fork-based SPM are different. In particular, the wires used in STM are typically 250 - 500 μ m in diameter, while the wires used for tuning-fork-based SPM are usually an order of magnitude narrower in order to minimize loading of the tuning fork: 25 - 50 μ m and sometimes down to a few micrometers in diameter. Consequently, many of the recipes developed for etching thicker metallic wires for STM tips do not give optimal results for smaller diameter wires. The authors describe here a modification of the etching circuit of Ibe et al. that significantly improves the reproducibility and reliability of the etching process for thin wires, and discuss the parameters that affect the aspect ratio of produced tips.

Original languageEnglish (US)
Article number024004
JournalJournal of Vacuum Science and Technology B: Nanotechnology and Microelectronics
Volume38
Issue number2
DOIs
StatePublished - Mar 1 2020

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Process Chemistry and Technology
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering
  • Materials Chemistry

Fingerprint Dive into the research topics of 'Etching sharp tips from thin metallic wires for tuning-fork-based scanning probe microscopy'. Together they form a unique fingerprint.

  • Cite this