Evaluation of HPK n+-p planar pixel sensors for the CMS Phase-2 upgrade

The Tracker Group of the CMS Collaboration

doi:10.1016/j.nima.2023.168326

Evaluation of HPK n⁺-p planar pixel sensors for the CMS Phase-2 upgrade

The Tracker Group of the CMS Collaboration

Physics and Astronomy

Research output: Contribution to journal › Article › peer-review

4 Scopus citations

Abstract

To cope with the challenging environment of the planned high luminosity upgrade of the Large Hadron Collider (HL-LHC), scheduled to start operation in 2029, CMS will replace its entire tracking system. The requirements for the tracker are largely determined by the long operation time of 10 years with an instantaneous peak luminosity of up to 7.5 × 10³⁴cm⁻²s⁻¹ in the ultimate performance scenario. Depending on the radial distance from the interaction point, the silicon sensors will receive a particle fluence corresponding to a non-ionising energy loss of up to Φ_eq= 3.5 × 10¹⁶cm⁻². This paper focuses on planar pixel sensor design and qualification up to a fluence of Φ_eq = 1.4 × 10¹⁶cm⁻². For the development of appropriate planar pixel sensors an R&D program was initiated, which includes n⁺-p sensors on 150mm (6”) wafers with an active thickness of 150µm with pixel sizes of 100×25 µm² and 50×50 µm² manufactured by Hamamatsu Photonics K.K. (HPK). Single chip modules with ROC4Sens and RD53A readout chips were made. Irradiation with protons and neutrons, as well was an extensive test beam campaign at DESY were carried out. This paper presents the investigation of various assemblies mainly with ROC4Sens readout chips. It demonstrates that multiple designs fulfil the requirements in terms of breakdown voltage, leakage current and efficiency. The single point resolution for 50×50 µm² pixels is measured as 4.0µm for non-irradiated samples, and 6.3µm after irradiation to Φ_eq = 7.2 × 10¹⁵cm⁻².

Original language	English (US)
Article number	168326
Journal	Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
Volume	1053
DOIs	https://doi.org/10.1016/j.nima.2023.168326
State	Published - Aug 2023

Funding

This work was supported by the German Federal Ministry of Education and Research (BMBF) in the framework of the “FIS-Projekt - Fortführung des CMS-Experiments zum Einsatz am HL-LHC: Verbesserung des Spurdetektors für das Phase-2 Upgrade des CMS-Experiments” and supported by the H2020 project AIDA-2020, GA no. 654168. The measurements leading to these results have been performed at the Test Beam Facility at DESY Hamburg (Germany), a member of the Helmholtz Association (HGF). The tracker groups gratefully acknowledge financial support from the following funding agencies: BMWFW and FWF (Austria); FNRS, Belgium and FWO (Belgium); CERN, Switzerland; MSE and CSF (Croatia); Academy of Finland, Finland, MEC, Canada, and HIP (Finland); CEA, United States and CNRS/IN2P3 (France); BMBF, DFG, United States, and HGF (Germany); GSRT (Greece); NKFIA K124850, and Bolyai Fellowship of the Hungarian Academy of Sciences (Hungary); DAE, India and DST (India); INFN (Italy); PAEC (Pakistan); SEIDI, Spain, CPAN, PCTI and FEDER (Spain); Swiss Funding Agencies (Switzerland); MST (Taipei); STFC (United Kingdom); DOE and NSF (U.S.A.). This project has received funding from the European Union's Horizon 2020 research and innovation programme under the Marie Skłodowska-Curie grant agreement No 884104 (PSI-FELLOW-III-3i). Individuals have received support from HFRI (Greece).

Keywords

CMS
HL-LHC
Pixel
Radiation hardness
Sensors
Silicon

ASJC Scopus subject areas

Nuclear and High Energy Physics
Instrumentation

Access to Document

10.1016/j.nima.2023.168326

Cite this

@article{5fa79499a4fe4db5904272ec46168ec3,

title = "Evaluation of HPK n+-p planar pixel sensors for the CMS Phase-2 upgrade",

abstract = "To cope with the challenging environment of the planned high luminosity upgrade of the Large Hadron Collider (HL-LHC), scheduled to start operation in 2029, CMS will replace its entire tracking system. The requirements for the tracker are largely determined by the long operation time of 10 years with an instantaneous peak luminosity of up to 7.5 × 1034cm−2s−1 in the ultimate performance scenario. Depending on the radial distance from the interaction point, the silicon sensors will receive a particle fluence corresponding to a non-ionising energy loss of up to Φeq= 3.5 × 1016cm−2. This paper focuses on planar pixel sensor design and qualification up to a fluence of Φeq = 1.4 × 1016cm−2. For the development of appropriate planar pixel sensors an R&D program was initiated, which includes n+-p sensors on 150mm (6”) wafers with an active thickness of 150µm with pixel sizes of 100×25 µm2 and 50×50 µm2 manufactured by Hamamatsu Photonics K.K. (HPK). Single chip modules with ROC4Sens and RD53A readout chips were made. Irradiation with protons and neutrons, as well was an extensive test beam campaign at DESY were carried out. This paper presents the investigation of various assemblies mainly with ROC4Sens readout chips. It demonstrates that multiple designs fulfil the requirements in terms of breakdown voltage, leakage current and efficiency. The single point resolution for 50×50 µm2 pixels is measured as 4.0µm for non-irradiated samples, and 6.3µm after irradiation to Φeq = 7.2 × 1015cm−2.",

keywords = "CMS, HL-LHC, Pixel, Radiation hardness, Sensors, Silicon",

author = "{The Tracker Group of the CMS Collaboration} and W. Adam and T. Bergauer and K. Damanakis and M. Dragicevic and R. Fr{\"u}hwirth and H. Steininger and W. Beaumont and Darwish, {M. R.} and T. Janssen and T. Kello and Sfar, {H. Rejeb} and {Van Mechelen}, P. and N. Breugelmans and M. Delcourt and {De Moor}, A. and J. D'Hondt and F. Heyen and S. Lowette and I. Makarenko and D. Muller and Sahasransu, {A. R.} and D. Vannerom and {Van Putte}, S. and Y. Allard and B. Clerbaux and S. Dansana and {De Lentdecker}, G. and H. Evard and L. Favart and D. Hohov and A. Khalilzadeh and K. Lee and M. Mahdavikhorrami and A. Malara and S. Paredes and N. Postiau and F. Robert and L. Thomas and {Vanden Bemden}, M. and P. Vanlaer and Y. Yang and A. Benecke and G. Bruno and F. Bury and C. Caputo and {De Favereau}, J. and C. Delaere and Donertas, {I. S.} and A. Giammanco and K. Hahn",

note = "Publisher Copyright: {\textcopyright} 2023 Elsevier B.V.",

year = "2023",

month = aug,

doi = "10.1016/j.nima.2023.168326",

language = "English (US)",

volume = "1053",

journal = "Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment",

issn = "0168-9002",

publisher = "Elsevier",

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TY - JOUR

T1 - Evaluation of HPK n+-p planar pixel sensors for the CMS Phase-2 upgrade

AU - The Tracker Group of the CMS Collaboration

AU - Adam, W.

AU - Bergauer, T.

AU - Damanakis, K.

AU - Dragicevic, M.

AU - Frühwirth, R.

AU - Steininger, H.

AU - Beaumont, W.

AU - Darwish, M. R.

AU - Janssen, T.

AU - Kello, T.

AU - Sfar, H. Rejeb

AU - Van Mechelen, P.

AU - Breugelmans, N.

AU - Delcourt, M.

AU - De Moor, A.

AU - D'Hondt, J.

AU - Heyen, F.

AU - Lowette, S.

AU - Makarenko, I.

AU - Muller, D.

AU - Sahasransu, A. R.

AU - Vannerom, D.

AU - Van Putte, S.

AU - Allard, Y.

AU - Clerbaux, B.

AU - Dansana, S.

AU - De Lentdecker, G.

AU - Evard, H.

AU - Favart, L.

AU - Hohov, D.

AU - Khalilzadeh, A.

AU - Lee, K.

AU - Mahdavikhorrami, M.

AU - Malara, A.

AU - Paredes, S.

AU - Postiau, N.

AU - Robert, F.

AU - Thomas, L.

AU - Vanden Bemden, M.

AU - Vanlaer, P.

AU - Yang, Y.

AU - Benecke, A.

AU - Bruno, G.

AU - Bury, F.

AU - Caputo, C.

AU - De Favereau, J.

AU - Delaere, C.

AU - Donertas, I. S.

AU - Giammanco, A.

AU - Hahn, K.

PY - 2023/8

Y1 - 2023/8

N2 - To cope with the challenging environment of the planned high luminosity upgrade of the Large Hadron Collider (HL-LHC), scheduled to start operation in 2029, CMS will replace its entire tracking system. The requirements for the tracker are largely determined by the long operation time of 10 years with an instantaneous peak luminosity of up to 7.5 × 1034cm−2s−1 in the ultimate performance scenario. Depending on the radial distance from the interaction point, the silicon sensors will receive a particle fluence corresponding to a non-ionising energy loss of up to Φeq= 3.5 × 1016cm−2. This paper focuses on planar pixel sensor design and qualification up to a fluence of Φeq = 1.4 × 1016cm−2. For the development of appropriate planar pixel sensors an R&D program was initiated, which includes n+-p sensors on 150mm (6”) wafers with an active thickness of 150µm with pixel sizes of 100×25 µm2 and 50×50 µm2 manufactured by Hamamatsu Photonics K.K. (HPK). Single chip modules with ROC4Sens and RD53A readout chips were made. Irradiation with protons and neutrons, as well was an extensive test beam campaign at DESY were carried out. This paper presents the investigation of various assemblies mainly with ROC4Sens readout chips. It demonstrates that multiple designs fulfil the requirements in terms of breakdown voltage, leakage current and efficiency. The single point resolution for 50×50 µm2 pixels is measured as 4.0µm for non-irradiated samples, and 6.3µm after irradiation to Φeq = 7.2 × 1015cm−2.

AB - To cope with the challenging environment of the planned high luminosity upgrade of the Large Hadron Collider (HL-LHC), scheduled to start operation in 2029, CMS will replace its entire tracking system. The requirements for the tracker are largely determined by the long operation time of 10 years with an instantaneous peak luminosity of up to 7.5 × 1034cm−2s−1 in the ultimate performance scenario. Depending on the radial distance from the interaction point, the silicon sensors will receive a particle fluence corresponding to a non-ionising energy loss of up to Φeq= 3.5 × 1016cm−2. This paper focuses on planar pixel sensor design and qualification up to a fluence of Φeq = 1.4 × 1016cm−2. For the development of appropriate planar pixel sensors an R&D program was initiated, which includes n+-p sensors on 150mm (6”) wafers with an active thickness of 150µm with pixel sizes of 100×25 µm2 and 50×50 µm2 manufactured by Hamamatsu Photonics K.K. (HPK). Single chip modules with ROC4Sens and RD53A readout chips were made. Irradiation with protons and neutrons, as well was an extensive test beam campaign at DESY were carried out. This paper presents the investigation of various assemblies mainly with ROC4Sens readout chips. It demonstrates that multiple designs fulfil the requirements in terms of breakdown voltage, leakage current and efficiency. The single point resolution for 50×50 µm2 pixels is measured as 4.0µm for non-irradiated samples, and 6.3µm after irradiation to Φeq = 7.2 × 1015cm−2.

KW - CMS

KW - HL-LHC

KW - Pixel

KW - Radiation hardness

KW - Sensors

KW - Silicon

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U2 - 10.1016/j.nima.2023.168326

DO - 10.1016/j.nima.2023.168326

M3 - Article

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SN - 0168-9002

VL - 1053

JO - Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

JF - Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

M1 - 168326

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