Experimental and Micromechanics Analysis on Fatigue Crack Propagation Behavior in Sn-Ag Eutectic Solder

Yao Yao*, Semyon Vaynman, Leon M. Keer, Morris E. Fine

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

Fatigue experiments were conducted on Sn-3.5Ag solder alloys to study the fatigue failure of Sn-Ag eutectic solder. Fatigue crack propagation in Mode I loading was studied utilizing a solder-joint plate specimen. Fatigue crack propagation tests were performed at room temperature in a servo-hydraulic fatigue machine (MTS-810) under load control with maximum load of 2400N and the load ratio of 0.1. The crack growth was monitored by a traveling microscope. Scanning electron microscopy (SEM) and optical microscope examinations were performed directly on the specimens. It is found that the crack gradually propagates in a direction approximately perpendicular to the stress direction through the region with accumulation of dislocations. After 867000 cycles, when the crack grew to approximately 13mm in the horizontal direction, the crack migrated to the copper/solder interface resulting in sudden catastrophic failure. A micromechanics approach was applied to predict fatigue crack propagation, which matches good with experimental data.

Original languageEnglish (US)
Title of host publicationFatigue of Materials
Subtitle of host publicationAdvances and Emergences in Understanding
PublisherWiley-Blackwell
Pages19-28
Number of pages10
ISBN (Electronic)9781118013373
ISBN (Print)9780470943182
DOIs
StatePublished - Nov 11 2010

Keywords

  • Crack propagation
  • Experiment
  • Failure
  • Fatigue
  • Phase transformation
  • Sn-Ag solder

ASJC Scopus subject areas

  • Engineering(all)
  • Materials Science(all)

Fingerprint

Dive into the research topics of 'Experimental and Micromechanics Analysis on Fatigue Crack Propagation Behavior in Sn-Ag Eutectic Solder'. Together they form a unique fingerprint.

Cite this